System and method for detecting thickness and bow of large-sized wafers

    公开(公告)号:US12123699B1

    公开(公告)日:2024-10-22

    申请号:US18632298

    申请日:2024-04-11

    CPC classification number: G01B11/022 G01B11/06 G01B11/2441 H04N23/695

    Abstract: A system for detecting a thickness and a bow of a large-sized wafer and a method for detecting a thickness and a bow of a large-sized wafer are provided and relate to wafer detection, the system includes a transportation mechanism, a handling mechanism and a detection mechanism. The transportation mechanism includes a transportation belt and is configured to transport the wafer. The handling mechanism includes a mechanical arm, an end of the mechanical arm is provided with multiple vacuum suction cups, and the handling mechanism is configured to transport the wafer from the handling mechanism to the detection mechanism. The detection mechanism includes a bearing structure and an optical detection structure, and is configured to detect the thickness and the bow of the wafer. The bearing structure includes multiple strings configured to bear the wafer. The optical detection structure includes a camera and a liquid crystal display (LCD) panel.

    METHOD AND SYSTEM FOR DETERMINING A THREE-DIMENSIONAL DEFINITION OF AN OBJECT BY REFLECTOMETRY

    公开(公告)号:US20240125594A1

    公开(公告)日:2024-04-18

    申请号:US17769543

    申请日:2020-10-16

    Abstract: A method and system for scanning an outer surface of a three-dimensional object, the outer surface being reflective, the method comprising the following steps: (a) projecting a light pattern on the object with a relative movement between the light pattern and the object; (b) recording with cameras images of the light pattern reflected by the outer surface during the relative movement; (c) processing the recorded reflection images by identifying the outline of the light pattern and determining from the outline characteristics of the outer surface; wherein the light pattern comprises at least one homogenously illuminated strip extending transversally to a direction of the relative movement with at least one border with a non-straight profile so as to form a non-constant width of the strip; and in step (c) the speed of the relative movement is taken into account for determining a three-dimensional definition of the outer surface.

    Intra-oral scanning device with integrated optical coherence tomography (OCT)

    公开(公告)号:US11925435B2

    公开(公告)日:2024-03-12

    申请号:US17836606

    申请日:2022-06-09

    Abstract: An intra-oral scanning device includes a light source and an optical system, and communicates with a display system. The device provides for more efficient transmission and capture of images. It integrates OCT scanning with RGB-based scanning. In operation, the device is used for recording topological characteristics of teeth, dental impressions, or stone models by digital methods and for use in CAD/CAM of dental restorative prosthetic devices. To that end, the RGB-based scan obtains surface data (e.g., a margin), while the OCT scan penetrates the surface. The two scanners operate from within the same physical housing and preferably at the same time such that only one scanning pass (to obtain all necessary data) is required. The 3D data obtained from the OCT scan is registered with the 3D data obtained from the RGB-based scan by virtue of being captured using a common return path. Preferably, the 3D surface data is used to align the volume data, such that the OCT scan operates over a much sparser scanning volume than would otherwise be required if the OCT scan were carried out separately. In this manner, there is less stitching of data required to build the output images, thereby enabling a “one-pass” operation.

    MEASURING DEVICE AND MACHINING DEVICE
    7.
    发明公开

    公开(公告)号:US20240068798A1

    公开(公告)日:2024-02-29

    申请号:US18237527

    申请日:2023-08-24

    Inventor: Tasuku SHIMIZU

    CPC classification number: G01B11/005 G01B5/008 G01B11/2441

    Abstract: A measuring device includes a table on which a workpiece is to be mounted, a first imaging unit configured to image the surface of the workpiece on the table, a second imaging unit configured to image the surface of the workpiece on the table, the second imaging unit allowing measurement of a shape and/or roughness of the surface of the workpiece according to a plurality of images taken by scanning the surface of the workpiece in a Z-axis direction, and an image processing unit configured to process the image of the surface of the workpiece taken by the first imaging unit and the plurality of images taken by scanning the surface of the workpiece in the Z-axis direction by the second imaging unit, so as to measure the shape and/or the roughness of the surface of the workpiece.

    Measuring apparatus for interferometrically determining a surface shape

    公开(公告)号:US11892283B2

    公开(公告)日:2024-02-06

    申请号:US17708409

    申请日:2022-03-30

    Abstract: A measurement apparatus (10) for interferometrically determining a surface shape of a test object (14). A radiation source provides an input wave (42), a multiply-encoded diffractive optical element (60), which is configured to produce by diffraction from the input wave a test wave (66) that is directed at the test object and has a wavefront in the form of a free-form surface and at least one calibration wave (70), and a capture device (46). The calibration wave has a wavefront with a non-rotationally symmetric shape (68f), wherein cross sections through the wavefront of the calibration wave along cross-sectional surfaces each aligned transversely to one another have a curved shape. The curved shapes in the different cross-sectional surfaces differ in terms of an opening parameter. The capture device (46) captures a calibration interferogram formed by superimposing a reference wave (40) with the calibration wave after interaction with a calibration object (74).

    SEMICONDUCTOR MEASUREMENT APPARATUS
    9.
    发明公开

    公开(公告)号:US20230375463A1

    公开(公告)日:2023-11-23

    申请号:US18082040

    申请日:2022-12-15

    Abstract: A semiconductor measurement apparatus includes an illumination unit configured to provide illumination light including linearly polarized light beams having different wavelengths, an optical unit including an objective lens configured to allow the illumination light to be incident on a sample, the optical unit being configured to transmit reflection light generated when the illumination light is reflected from the sample, a self-interference generator configured to self-interfere the reflection light transmitted from the optical unit and transmit the reflection light to a first image sensor, for each wavelength, and a controller. The controller is configured to process a measurement image output by the image sensor to divide the measurement image into a first image representing an intensity ratio of a polarization component of the reflection light and a second image representing a phase difference of the polarization component of the reflection light, for each wavelength.

    THREE-DIMENSIONAL MEASUREMENT DEVICE
    10.
    发明公开

    公开(公告)号:US20230243643A1

    公开(公告)日:2023-08-03

    申请号:US18295845

    申请日:2023-04-05

    Abstract: A three-dimensional measurement device includes: a light emitter; an optical system that splits an incident light, irradiates a measurement object with an object light and irradiates a reference plane with a reference light, and recombines the object and reference lights and emits a combined light; an imaging device that takes an image of a light emitted from the optical system; a storage device that stores transmission axis absolute angle data each obtained by a previous actual measurement of an absolute angle of a transmission axis of each polarizer; and a control device that calculates a phase difference between the reference and object lights based on luminance data of each pixel in luminance image data and the transmission axis absolute angle data of each polarizer corresponding to the pixel, and measures a height of the measurement object at the measurement position.

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