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公开(公告)号:US20140101964A1
公开(公告)日:2014-04-17
申请号:US13650044
申请日:2012-10-11
Applicant: LAM RESEARCH CORPORATION
Inventor: Stephen M. SIRARD , Diane HYMES , Alan M. SCHOEPP , Ratchana LIMARY
CPC classification number: H01L21/67034 , H01L21/02057 , H01L21/6831
Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.
Abstract translation: 提供了一种用于分层干燥基板的设备。 提供了用于接收基板的室。 卡盘支撑并夹紧腔室内的基底。 温度控制器控制衬底的温度并能够冷却衬底。 真空泵与腔室流体连接。 倾斜机构能够将卡盘倾斜至少90度。