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公开(公告)号:US20140101964A1
公开(公告)日:2014-04-17
申请号:US13650044
申请日:2012-10-11
Applicant: LAM RESEARCH CORPORATION
Inventor: Stephen M. SIRARD , Diane HYMES , Alan M. SCHOEPP , Ratchana LIMARY
CPC classification number: H01L21/67034 , H01L21/02057 , H01L21/6831
Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.
Abstract translation: 提供了一种用于分层干燥基板的设备。 提供了用于接收基板的室。 卡盘支撑并夹紧腔室内的基底。 温度控制器控制衬底的温度并能够冷却衬底。 真空泵与腔室流体连接。 倾斜机构能够将卡盘倾斜至少90度。
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公开(公告)号:US20210143032A1
公开(公告)日:2021-05-13
申请号:US17053110
申请日:2019-05-02
Applicant: LAM RESEARCH CORPORATION
Inventor: Dong Woo PAENG , Yunsang S. KIM , He ZHANG , Keith WELLS , Alan M. SCHOEPP
Abstract: A substrate processing system includes a processing chamber, a substrate support, a laser, and a collimating assembly. The substrate support is disposed in the processing chamber and is configured to support a substrate. The laser is configured to generate a laser beam. The collimating assembly includes lenses or minors arranged to direct the laser beam at the substrate to heat an exposed material of the substrate. The lenses or mirrors are configured to direct the laser beam in a direction within a predetermined range of being perpendicular to a surface of the substrate.
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