公开(公告)号：US20140101964A1

公开(公告)日：2014-04-17

申请号：US13650044

申请日：2012-10-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Stephen M. SIRARD ,  Diane HYMES ,  Alan M. SCHOEPP ,  Ratchana LIMARY

IPC: F26B13/30 ,  F26B5/06 ,  F25B21/02

CPC classification number: H01L21/67034 ,  H01L21/02057 ,  H01L21/6831

Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.

Abstract translation: 提供了一种用于分层干燥基板的设备。 提供了用于接收基板的室。 卡盘支撑并夹紧腔室内的基底。 温度控制器控制衬底的温度并能够冷却衬底。 真空泵与腔室流体连接。 倾斜机构能够将卡盘倾斜至少90度。

公开(公告)号：US20240429040A1

公开(公告)日：2024-12-26

申请号：US18826414

申请日：2024-09-06

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Ratchana LIMARY ,  Yang PAN ,  Diane HYMES

IPC: H01L21/02 ,  H01L21/306 ,  H01L21/67

Abstract: A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.

公开(公告)号：US20220328338A1

公开(公告)日：2022-10-13

申请号：US17639869

申请日：2020-09-01

Applicant: Lam Research Corporation ,  The Regents of the University of California

Inventor： Gregory BLACHUT ,  Diane HYMES ,  Stephen M. SIRARD ,  Ratchana LIMARY ,  Christopher M. Bates

IPC: H01L21/683

Abstract: The present disclosure relates to methods of forming a film including small molecules. Such methods can optionally include removing such small molecules, such as by way of sublimation, evaporation, or conversion to a more volatile form.

公开(公告)号：US20240312778A1

公开(公告)日：2024-09-19

申请号：US18044336

申请日：2021-09-09

Applicant: Lam Research Corporation

Inventor： Stephen J. BANIK, II ,  Bryan L. BUCKALEW ,  Stephen M. SIRARD ,  Gregory BLACHUT ,  Ratchana LIMARY ,  Diane HYMES ,  Justin OBERST ,  Priyanka SURESH

IPC: H01L21/02 ,  G03F7/00

CPC classification number: H01L21/02334 ,  G03F7/70008 ,  H01L21/02277 ,  H01L21/0228

Abstract: The present disclosure relates to use of a stimulus responsive polymer (SRP) as a capping material during direct metal-metal binding. Processes and layers employing an SRP are described herein.

公开(公告)号：US20230295412A1

公开(公告)日：2023-09-21

申请号：US18006552

申请日：2021-07-23

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Gregory BLACHUT ,  Ratchana LIMARY ,  Diane HYMES ,  Yang PAN

IPC: C08L61/18 ,  B05D1/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

CPC classification number: C08L61/18 ,  B05D1/005 ,  H01L21/56 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/293 ,  C08L2203/162 ,  C08L2203/206

Abstract: The present disclosure relates to a stimulus responsive polymer (SRP) that includes a homopolymer. Methods, films, and formulations employing an SRP are also described herein.