公开(公告)号：US08921987B2

公开(公告)日：2014-12-30

申请号：US13870436

申请日：2013-04-25

Applicant: LAPIS Semiconductor Co., Ltd.

Inventor： Toshihisa Sone ,  Kazuya Yamada ,  Akihiro Takei ,  Yuichi Yoshida ,  Kengo Takemasa

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49596 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H01L2924/3701 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.

Abstract translation: 半导体器件包括：振荡器，包括设置在沿第一方向具有特定距离的第一面上的外部端子; 包括沿着一侧形成有第一电极焊盘的第一区域和在所述第一区域的两个相对侧上形成有第二电极焊盘的第二区域的集成电路; 引线框架，其包括在周边部分的端子，并且其上安装有振荡器和集成电路，使得外部端子，第一和第二电极焊盘面向大致相同的方向，并且使得集成电路的一侧为 基本上平行于第一方向; 将一个外部端子连接到一个第一电极焊盘的第一接合线; 将一个引线框架的一个端子连接到一个第二电极焊盘的第二焊接线; 以及密封所有部件的密封构件。