公开(公告)号：US10290687B2

公开(公告)日：2019-05-14

申请号：US15701017

申请日：2017-09-11

Applicant: LG Display Co., Ltd.

Inventor： Shinbok Lee ,  Taejoon Song ,  Namkook Kim ,  Soonsung Yoo ,  Hwankeon Lee

IPC: H01L27/32 ,  H01L51/50 ,  H01L51/52

Abstract: A lighting apparatus using an organic light emitting diode and a method of fabricating the same according to the present disclosure is configured such that a contact electrode is formed using laser ablation and printing after an organic light emitting material, a conductive layer for a cathode and a passivation layer are deposited on an entire surface of a substrate, and then encapsulated with a metal film.The present disclosure simplifies a fabricating process of the lighting apparatus by virtue of a non-use of an open mask (metal mask) as a sophisticated apparatus, and particularly, can be effectively applied to a roll-producing process.Also, the present disclosure can provide an effect of improving reliability by preventing moisture permeation in a manner of covering an exposed contact portion with a protection film such as a barrier tape.

公开(公告)号：US12150336B2

公开(公告)日：2024-11-19

申请号：US17115553

申请日：2020-12-08

Applicant: LG Display Co., Ltd.

Inventor： Jungeun Lee ,  Chulho Kim ,  Namkook Kim ,  Sungwoo Choi ,  Hwankeon Lee ,  Youngkyun Moon ,  Jihun Lee

IPC: H10K50/858 ,  H10K59/122 ,  H10K59/38

Abstract: The present disclosure relates to a display device. More particularly, the present disclosure relates to a display device capable of enhancing efficiency of light emitted from a light-emitting element. A display device according to an embodiment includes a substrate on which areas of pixels composed of multiple subpixels are arranged, a circuit element layer in which circuit elements constituting the multiple subpixels are provided, a light-emitting element layer in which light-emitting elements constituting the multiple subpixels are provided, and a lens placed corresponding to the light-emitting element.

公开(公告)号：US10418571B2

公开(公告)日：2019-09-17

申请号：US15709103

申请日：2017-09-19

Applicant: LG DISPLAY CO., LTD.

Inventor： Taejoon Song ,  Namkook Kim ,  Shinbok Lee ,  Soonsung Yoo ,  Hwankeon Lee

IPC: H01L29/18 ,  H01L21/00 ,  H01L51/00 ,  H01L51/52

Abstract: A lighting apparatus of the present disclosure may transport a film formed with a plurality of lighting apparatuses between rolls, and place a mask on an entire surface of the film to deposit an organic light emitting material in a state in which a part of the film is blocked to form an organic light emitting layer, and then deposit a metal layer by the same mask to form a second electrode, wherein the organic light emitting layer and the second electrode are not formed in a region where a pad is formed by the mask to open the pad and connect an external signal source thereto. The first electrode may be connected to a first pad and the second electrode may be connected to a second pad to apply a voltage, wherein a part of the organic light emitting layer is laser-etched to form a contact portion, and the second electrode is electrically connected to the second pad.

公开(公告)号：US20190165297A1

公开(公告)日：2019-05-30

申请号：US16197301

申请日：2018-11-20

Applicant: LG DISPLAY CO., LTD.

Inventor： Kyu-Hwang Lee ,  Taejoon Song ,  Chulho Kim ,  Hwankeon Lee

IPC: H01L51/52 ,  H01L27/32 ,  G09G3/3225

Abstract: Disclosed herein is an OLED lighting apparatus which can achieve both improvement in reliability and reduction in manufacturing cost. In the OLED lighting apparatus, an encapsulation layer is disposed over the active area and the non-active area on a buffer layer, such that a pad disposed in the non-active area of the buffer layer can be stably secured by the encapsulation layer bonded thereto. Accordingly, upon tape automated bonding between an FPCB substrate with a COF tape attached thereto and a via electrode, the COF tape does not directly contact the pad but contacts the via electrode connected to the pad, particularly a connection terminal of the via electrode disposed on an upper surface of the encapsulation layer, thereby establishing electrical connection between the FPCB substrate and the via electrode. In this way, the connection terminal of the via electrode is electrically connected to the FPCB substrate via the COF tape, whereby a signal from the outside can be applied to the pad connected to the via electrode.

公开(公告)号：US10079361B2

公开(公告)日：2018-09-18

申请号：US15699840

申请日：2017-09-08

Applicant: LG Display Co., Ltd.

Inventor： Taejoon Song ,  Namkook Kim ,  Shinbok Lee ,  Soonsung Yoo ,  Hwankeon Lee

IPC: H01L51/10 ,  H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5246 ,  H01L27/3276 ,  H01L27/3288 ,  H01L27/329 ,  H01L51/0017 ,  H01L51/0021 ,  H01L51/0097 ,  H01L51/102 ,  H01L51/5203 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/5361

Abstract: A lighting apparatus using an organic light-emitting diode and a method of fabricating the same are characterized in that an organic emissive material and a conductive film used as a cathode are deposited on the entire surface of a substrate, and then an organic emissive layer in a lighting area and contact areas becomes separated (disconnected or cut) by laser ablation, simultaneously with the formation of a contact hole for contact with an anode. Next, cathode contact and encapsulation processes are performed using an adhesive containing conductive particles and a metal film. This simplifies the fabrication process of the lighting apparatus without using an open mask (metal mask), which is a complicated tool, thus making it useful especially in roll-to-roll manufacturing.