公开(公告)号：US20060220191A1

公开(公告)日：2006-10-05

申请号：US11096823

申请日：2005-04-01

Applicant: Lance Sundstrom

Inventor： Lance Sundstrom

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe for an electronic package is provided. The lead frame includes a plurality of leads each having an outer lead bond and an inner lead bond. The plurality of leads are interconnected by a tie bar. The plurality of leads have a first pitch at an exit or attach point for an electronic package and a second, larger pitch at the outer lead bonds.

Abstract translation: 提供电子封装的引线框架。 引线框架包括多个引线，每个引线具有外引线接合和内引线接合。 多个引线通过连接杆相互连接。 多个引线在电子封装的出口或附着点处具有第一间距，在外部引线键处具有第二较大间距。