摘要:
A method and structure of manufacture of mask ROM device is provided. Firstly, a semiconductor structure is provided that comprises a first dielectric layer, a plurality of buried bit lines and a plurality of code areas, wherein each of the code areas is placed between two buried bit lines. Next, a second dielectric layer having a plurality of contact plugs is formed on the semiconductor structure, wherein the contact plug comprises a second dielectric layer and a first glue layer, furthermore; the first glue layer is placed on the side-wall and bottom of the contact plugs. In addition, the contact plugs filled with the first metal layer. Then, a second glue layer, a second metal layer and a pad layer having an opening pattern are respectively formed on the second dielectric layer and contact plug. Thus, the processes of the present invention can improve the stability and accuracy in the electricity of the mask ROM device.
摘要:
A bias voltage generator generates the same bias voltage VBB for different external power supply voltages EVCC (for example, for EVCC=3.3V or 5.0V). During power-up, the charge pump that generates VBB is controlled by an enable signal ExtEn referenced to EVCC. Later an internal supply voltage IVCC becomes fully developed to a value independent from EVCC (for example, IVCC=3.0V), and the charge pump becomes controlled by an enable signal IntEn referenced to IVCC. This enable signal IntEn will cause VBB to reach its target value, for example, -1.5V. This target value is independent of EVCC. During power-up, when the charge pump is controlled by ExtEn, the bias voltage VBB is driven to an intermediate value (for example, -0.5V or -1V). This intermediate value depends on EVCC, but is below the target value in magnitude. The intermediate value reduces the likelihood of latch-up during power-up, but the intermediate value does not go beyond the target value thus does not create a significant pn-junction current leakage in semiconductor regions to which the bias voltage is applied.
摘要:
A sense amplifier charging circuit can work with different power supply voltages (EVCC). When EVCC is high, a signal generated from EVCC disables some of the charging transistors to reduce the circuit noise. When EVCC is low, the signal generated from EVCC enables the transistors thus increasing the circuit speed.
摘要:
A dynamic random access memory generates an internal power supply voltage IVCC. IVCC is lower in magnitude than the external power supply voltage EVCC. During a read operation, the sense amplifiers are powered from EVCC while the bit lines charge to their output levels. Then the sense amplifiers stop being powered from EVCC and begin being powered from IVCC to maintain the bit lines at their output levels. A timer defines the time that the sense amplifiers are powered from EVCC. This time depends inversely on EVCC. The timer includes a transistor connected between EVCC and an input of the inverter. The time that the sense amplifiers are powered from EVCC is defined by the time that the input of the inverter charges to the trip point of the inverter.