公开(公告)号：US10262828B2

公开(公告)日：2019-04-16

申请号：US15606081

申请日：2017-05-26

Applicant: Littelfuse, Inc.

Inventor： Michael Schlaak ,  Gregory Stumpo ,  Ken Venhaus ,  Derek Lasini

IPC: H01H69/02 ,  H01H85/042 ,  H01H85/175 ,  H01H85/38 ,  H01H85/18 ,  H01H85/08 ,  H01H85/10

Abstract: A fuse includes a fuse element and a fuse body. A portion of the fuse element is housed in a fuse body. The fuse element includes a first terminal and a second terminal disposed outside of the fuse body. The first terminal and the second terminal electrically connects the fuse element to a circuit to be protected and a power source. A first endbell and a second endbell is coupled to the fuse element. A predetermined amount of arc quenching material is disposed within the fuse body. The arc quenching material contacts at least a portion of the fuse element. The predetermined amount of the arc quenching material is less than a total volume size of the fuse tube. The arc quenching material is compacted. A remaining air gap in the fuse tube is filled with a liquid adhesive and cured to a solid state.

公开(公告)号：US20170213682A1

公开(公告)日：2017-07-27

申请号：US15410440

申请日：2017-01-19

Applicant: Littelfuse, Inc.

Inventor： James Becker ,  Gregory Stumpo

IPC: H01H85/04 ,  H01H69/02 ,  H01H85/20 ,  H05K3/30 ,  H05K1/18

CPC classification number: H01H85/04 ,  H01H69/02 ,  H01H85/20 ,  H01H85/203 ,  H05K1/181 ,  H05K2201/10181 ,  Y02P70/611

Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.