Tamper sensing method and apparatus
    11.
    发明授权
    Tamper sensing method and apparatus 有权
    防篡改感测方法和装置

    公开(公告)号:US07049970B2

    公开(公告)日:2006-05-23

    申请号:US10691291

    申请日:2003-10-22

    IPC分类号: G08B17/02

    摘要: A tamper sensing circuit is provided for an electrical device wherein an enclosure may be opened to access data by a user that does not possess the ability to achieve normal access by satisfying data security measures such as use of a password. A screw used to secure enclosure halves together is connected by a conductive coating at the enclosure member surface into which the screw is threaded to connect a tamper sensing circuit to the device ground potential. A tamper sensing circuit output node is maintained at the circuit ground potential as long as the screw is in electrical contact with the enclosure conductive coating. When the screw is disengaged from the enclosure member threaded opening, the output node is no longer grounded and rises to a supplied electrical potential indicating tampering and enabling appropriate corrective action. The conductive coating on the enclosure member which connects the screw to circuit ground may be applied or may already be present to suppress electromagnetic interference.

    摘要翻译: 为电气设备提供篡改感测电路,其中可以打开外壳以通过满足诸如使用密码的数据安全措施,不具有实现正常访问的能力的用户访问数据。 用于将外壳半部固定在一起的螺钉通过导电涂层连接在外壳构件表面,螺钉被螺纹连接到外壳构件表面以将篡改感测电路连接到设备接地电位。 只要螺钉与外壳导电涂层电接触,篡改感测电路输出节点就保持在电路接地电位。 当螺钉从外壳构件螺纹开口脱离时,输出节点不再接地,并且上升到所提供的电势,指示篡改并且使得能够进行适当的校正动作。 将螺钉连接到电路接地的外壳构件上的导电涂层可以被施加或已经存在以抑制电磁干扰。

    Apparatus and method for cooling a wearable computer

    公开(公告)号:US06542359B2

    公开(公告)日:2003-04-01

    申请号:US09748904

    申请日:2000-12-27

    IPC分类号: H05K720

    CPC分类号: G06F1/163 G06F1/203

    摘要: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.