公开(公告)号：US20250080198A1

公开(公告)日：2025-03-06

申请号：US18242012

申请日：2023-09-05

Applicant: MEDIATEK INC.

Inventor： Chih-Wei Chiu ,  Wei-Hsuan Chang ,  Yeh-Chun Kao ,  Chih-Wei Lee

IPC: H04B7/06 ,  H04B1/3827 ,  H04B7/0404 ,  H04B17/10

Abstract: A beam management method of an electronic device includes transmitting a detecting signal, receiving a reflecting signal of the detecting signal, determining blocked antennas of an antenna array of the electronic device according to the reflecting signal, and exciting only unblocked antennas of the antenna array. This will improve the radiation efficiency of the antenna array.

公开(公告)号：US11937371B2

公开(公告)日：2024-03-19

申请号：US17366468

申请日：2021-07-02

Applicant: MEDIATEK Inc.

Inventor： Wun-Jian Lin ,  Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh

IPC: H04B1/40 ,  H01Q1/12 ,  H01Q1/22 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01Q1/12 ,  H04B1/40 ,  H05K2201/10098

Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.

公开(公告)号：US11075459B2

公开(公告)日：2021-07-27

申请号：US16745303

申请日：2020-01-16

Applicant: MEDIATEK INC.

Inventor： Shao-Yu Huang ,  Yeh-Chun Kao ,  Chung-Hsin Chiang ,  Shih-Huang Yeh

IPC: H01Q5/385 ,  H01Q9/04 ,  H01Q21/06

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

公开(公告)号：US10892561B2

公开(公告)日：2021-01-12

申请号：US16189915

申请日：2018-11-13

Applicant: MediaTek Inc.

Inventor： Wun-Jian Lin ,  Shyh-Tirng Fang ,  Yeh-Chun Kao

IPC: H01Q21/06 ,  H01Q21/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q5/40 ,  H01Q21/30

Abstract: A multi-band antenna array includes first antenna elements and second antenna elements. Each first antenna element has a first shape spanned by a first long axis and a first short axis, the first long axis being longer than and perpendicular to the first short axis. Each second antenna element has a second shape spanned by a second long axis and a second short axis, the second long axis being longer than and perpendicular to the second short axis. The first long axis is non-parallel to the second long axis. The first antenna element and the second antenna element resonate at a high resonance frequency band along the first long axis and the second long axis, respectively, and the first antenna element and the second antenna element further resonate at a low resonance frequency band along the first short axis and the second short axis, respectively.

公开(公告)号：US20210327835A1

公开(公告)日：2021-10-21

申请号：US17361285

申请日：2021-06-28

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

公开(公告)号：US11081453B2

公开(公告)日：2021-08-03

申请号：US16452395

申请日：2019-06-25

Applicant: MediaTek Inc.

Inventor： Nai-Wei Liu ,  Yen-Yao Chi ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Tzu-Hung Lin ,  Wen-Sung Hsu

IPC: H01L23/66 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/48

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

公开(公告)号：US11024981B2

公开(公告)日：2021-06-01

申请号：US16378281

申请日：2019-04-08

Applicant: MediaTek Inc.

Inventor： Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh ,  Chen-Fang Tai

IPC: H01Q21/28 ,  H01Q9/18 ,  H01Q7/00 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q9/28 ,  H01Q9/16

Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

公开(公告)号：US20190214741A1

公开(公告)日：2019-07-11

申请号：US16240795

申请日：2019-01-07

Applicant: MEDIATEK INC.

Inventor： Chung-Hsin Chiang ,  Yeh-Chun Kao ,  Shih-Huang Yeh

IPC: H01Q21/06 ,  H01Q21/24 ,  H01Q7/00

CPC classification number: H01Q21/062 ,  H01Q7/00 ,  H01Q21/24

Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.