公开(公告)号：US11666768B2

公开(公告)日：2023-06-06

申请号：US17249555

申请日：2021-03-04

Applicant: Medtronic, Inc.

Inventor： Jonathan C. Sell ,  Robert T. Sandgren ,  Jayesh R. Patel ,  Elizabeth K. Formosa ,  Jeffrey Novotny ,  Wen Tan ,  Emily Paukert

IPC: A61N1/375 ,  A61N1/05 ,  H01R13/621 ,  H01R24/58 ,  H01R107/00

CPC classification number: A61N1/3752 ,  A61N1/0551 ,  H01R13/621 ,  H01R24/58 ,  H01R2107/00 ,  H01R2201/12

Abstract: A neuromodulation adaptor configured to provide an electrical coupling between an otherwise incompatible stimulation lead and neurostimulator device, the neuromodulation adaptor including a proximal portion having a plurality of electrical conductors spaced apart at a first pitch spacing and configured to electrically engage with a corresponding plurality of electrical terminals of a neurostimulator device, and a distal portion including a stimulation lead port assembly, the stimulation lead port assembly including an upper portion and a lower portion configured to house the plurality of conductor elements and a set screw assembly, the plurality of conductor elements and set screw assembly spaced apart at a second pitch spacing and configured to electrically engage with a corresponding plurality of electrical connectors of a stimulation lead.

公开(公告)号：US11679256B2

公开(公告)日：2023-06-20

申请号：US16948856

申请日：2020-10-02

Applicant: Medtronic, Inc.

Inventor： Robert T. Sandgren ,  Elizabeth K. Formosa ,  Kathryn E. Aman ,  Steven Deininger ,  Paul Eichstaedt ,  Randy S. Roles

IPC: A61N1/36 ,  A61N1/05 ,  A61N1/375

CPC classification number: A61N1/36007 ,  A61N1/0551 ,  A61N1/3606 ,  A61N1/36125 ,  A61N1/3752

Abstract: A method of replacing a neurostimulator device. The method including explanting a previously implanted neurostimulator device from a site; operably coupling a replacement neurostimulator device to a previously implanted stimulation lead; and implanting a replacement neurostimulator device within the site, the replacement neurostimulator device having a volume of about ten cc's or less, and the previously implanted neurostimulator device having a volume of greater than about ten cc's.

公开(公告)号：US20210275823A1

公开(公告)日：2021-09-09

申请号：US17249555

申请日：2021-03-04

Applicant: Medtronic, Inc.

Inventor： Jonathan C. Sell ,  Robert T. Sandgren ,  Jayesh R. Patel ,  Elizabeth K. Formosa ,  Jeffrey Novotny ,  Wen Tan ,  Emily Paukert

IPC: A61N1/375 ,  A61N1/05 ,  H01R24/58 ,  H01R13/621

Abstract: A neuromodulation adaptor configured to provide an electrical coupling between an otherwise incompatible stimulation lead and neurostimulator device, the neuromodulation adaptor including a proximal portion having a plurality of electrical conductors spaced apart at a first pitch spacing and configured to electrically engage with a corresponding plurality of electrical terminals of a neurostimulator device, and a distal portion including a stimulation lead port assembly, the stimulation lead port assembly including an upper portion and a lower portion configured to house the plurality of conductor elements and a set screw assembly, the plurality of conductor elements and set screw assembly spaced apart at a second pitch spacing and configured to electrically engage with a corresponding plurality of electrical connectors of a stimulation lead.