公开(公告)号：US20140286112A1

公开(公告)日：2014-09-25

申请号：US14223928

申请日：2014-03-24

Applicant: Micron Technology, Inc.

Inventor： Akira Ide ,  Naoki Ogawa

IPC: G11C7/04 ,  G11C7/22

CPC classification number: G11C7/04 ,  G11C5/04 ,  G11C7/1039 ,  G11C7/106 ,  G11C7/1066 ,  G11C7/1087 ,  G11C7/1093 ,  G11C7/222

Abstract: Disclosed herein is an apparatus that includes a first semiconductor chip including a first electrode, and a second semiconductor chip including a second electrode connected to the first electrode. One of the first and second semiconductor chips includes a first temperature sensor circuit generating a first detection signal, the first detection signal taking a first level when a temperature is equal to or higher than a first temperature, the first detection signal taking a second level when the temperature is lower than the first temperature; and a first delay code generation circuit outputting a first delay code signal in response to the first level of the first detection signal, and outputting a second delay code signal different from the first delay code signal in response to the second level of the first detection signal.

Abstract translation: 这里公开了一种装置，其包括：第一半导体芯片，包括第一电极;以及第二半导体芯片，包括与第一电极连接的第二电极。 第一和第二半导体芯片中的一个包括产生第一检测信号的第一温度传感器电路，当温度等于或高于第一温度时，第一检测信号取第一电平，第一检测信号取第二电平 温度低于第一温度; 以及响应于第一检测信号的第一电平而输出第一延迟码信号的第一延迟码产生电路，并且响应于第一检测信号的第二电平输出与第一延迟码信号不同的第二延迟码信号 。