公开(公告)号：US20160088250A1

公开(公告)日：2016-03-24

申请号：US14961037

申请日：2015-12-07

Applicant: Micron Technology, Inc.

Inventor： Zhiping Yin ,  Xiaofeng Fan ,  Xiangli Li

IPC: H04N5/3745 ,  H01L27/146 ,  H04N5/357

CPC classification number: H04N5/3745 ,  H01L27/14609 ,  H01L27/14612 ,  H01L27/14641 ,  H01L27/14645 ,  H04N5/3575

Abstract: Pixel array with shared pixels in a single column and associated devices, systems, and methods are disclosed herein. In one embodiment, a pixel array includes a floating diffusion region, a source a source follower transistor having a gate coupled to the floating diffusion region, a plurality of first pixels associated with a first color, and a plurality of second pixels associated with a second color different than the first color and arranged in a single column with the first pixels. The first and second pixels are configured to transfer charge to the floating diffusion region.

Abstract translation: 单列中具有共享像素的像素阵列以及相关联的设备，系统和方法在此公开。 在一个实施例中，像素阵列包括浮动扩散区域，源极跟随器晶体管，源极跟随器晶体管，其具有耦合到浮置扩散区域的栅极，与第一颜色相关联的多个第一像素，以及与第二颜色相关联的多个第二像素 颜色与第一颜色不同，并且排列在具有第一像素的单列中。 第一和第二像素配置成将电荷转移到浮动扩散区。

公开(公告)号：US10312232B1

公开(公告)日：2019-06-04

申请号：US16007903

申请日：2018-06-13

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  John B. Pusey ,  Zhiping Yin ,  Kevin G. Duesman

IPC: H01L27/02 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L27/115 ,  H01L49/02

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.

公开(公告)号：US20190148358A1

公开(公告)日：2019-05-16

申请号：US16007903

申请日：2018-06-13

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  John B. Pusey ,  Zhiping Yin ,  Kevin G. Duesman

IPC: H01L27/02 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L49/02 ,  H01L27/115

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.

公开(公告)号：US10128229B1

公开(公告)日：2018-11-13

申请号：US15811572

申请日：2017-11-13

Applicant: Micron Technology, Inc.

Inventor： James E. Davis ,  John B. Pusey ,  Zhiping Yin ,  Kevin G. Duesman

IPC: H01L27/02 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L49/02 ,  H01L27/115

Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.