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公开(公告)号：US20100244875A1
公开(公告)日：2010-09-30
申请号：US12629790
申请日：2009-12-02
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , G01R1/06733 , G01R3/00 , H01R12/714 , H01R13/2421 , H01R13/2428 , H01R2201/20
摘要： The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.
摘要翻译： 接触组件具有接触构件，其接触尖端位于测试插座或探针板中的孔内，其中接触尖端或探针板或测试插座中的孔具有凸轮表面，以提供接触尖端跨越表面的横向运动 在接触构件的压缩期间测试位置以在测试位置的表面上诱导洗涤。
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公开(公告)号：US5557211A
公开(公告)日：1996-09-17
申请号：US462229
申请日：1995-06-05
CPC分类号： G01R1/07328
摘要： A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment. The latches can comprise part of a guide post assembly for guiding vertical travel of the top plate during vacuum cycling of the test fixture. An optical alignment system in combination with the movable bearings provides a quick and easy means of aligning the board and the probes with extremely high accuracy.
摘要翻译： 用于测试电路板的测试夹具在固定探针板和可移动顶板之间具有真空室。 位于夹具象限中的可分离的可调直线轴承提供顶板和探针板之间的平行对准。 探头板和顶板之间的连续真空密封件绕过轴承，因此轴承位于真空区域之外。 探针板中的弹簧加载的测试探针延伸穿过顶板中的孔，用于进入被测电路板。 当顶板在真空下向下移动探针时，探针接触板。 顶板通过延伸穿过直线轴承的单独的快速释放闩锁销固定到探针板上。 移动的顶板承载用于将板安装到顶板的固定工具销。 可移动轴承座支撑轴承。 顶板可移动以使板与测试探针对准。 顶板，闩锁销，轴承和轴承座可作为相对于探针板的单元移动。 在顶板与探针对准以补偿电路板批次之间的技术偏移之后，快速释放闩锁被接合以保持对准。 闩锁可以包括用于在测试夹具的真空循环期间引导顶板的垂直行进的导柱组件的一部分。 与可移动轴承结合的光学对准系统提供了一种快速且简便的方法，可以极高的精度对准电路板和探头。
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公开(公告)号：US5180976A
公开(公告)日：1993-01-19
申请号：US757006
申请日：1991-09-09
IPC分类号： G01R1/04 , G01R31/316
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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14.发明授权
公开(公告)号：US5134280A
公开(公告)日：1992-07-28
申请号：US715025
申请日：1991-06-13
申请人： Charles J. Johnston , Mark A. Swart
发明人： Charles J. Johnston , Mark A. Swart
CPC分类号： G02B6/3616 , G02B6/3873 , G02B6/4202 , G02B6/3821
摘要： Optical fiber test probes test the optical functions of light-emitting circuit elements or displays, or are used in optical test fixtures. In one embodiment, an optical fiber test probe comprises an optical fiber in two sections in which both are movable with a receptacle against the bias of a compression spring during testing. One fiber is contained within a removable barrel so it can be replaced by removing it from the receptacle independently of the compression spring. In their operative test position, the two optical fibers are mounted in the receptacle to maintain light-tight optical continuity during testing. In another embodiment, an optical fiber test probe comprises a barrel and an optical fiber contained within a plunger movable in the barrel, in which a free end portion of the optical fiber extends unsupported through a compression spring which applies a spring bias to an internal end of the plunger. The fiber optic probe is isolated from loads imposed on the plunger during repetitive testing with the probe. A further embodiment comprises a fiber optic test having a low compliance, one-piece, spring loaded, molded plastic optical fiber retainer.
摘要翻译： 光纤测试探头测试发光电路元件或显示器的光学功能，或用于光学测试夹具。 在一个实施例中，光纤测试探头包括在两个部分中的光纤，其中两个部分在测试期间可抵抗压缩弹簧的偏压与插座一起移动。 一个纤维被容纳在可移除的桶内，因此可以独立于压缩弹簧将其从容器中取出来进行更换。 在其操作测试位置，两个光纤安装在插座中，以在测试期间保持不透光的光学连续性。 在另一个实施例中，光纤测试探针包括筒体和容纳在可在筒体内移动的柱塞内的光纤，其中光纤的自由端部分通过压缩弹簧而不支撑，该弹簧将弹簧偏压施加到内部端 的柱塞。 光纤探头与使用探头进行重复测试时与施加在柱塞上的负载隔离。 另一实施例包括具有低顺应性，单件式，弹簧加载的模制塑料光纤保持器的光纤测试。
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公开(公告)号：US5444387A
公开(公告)日：1995-08-22
申请号：US196588
申请日：1994-02-10
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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公开(公告)号：US5422575A
公开(公告)日：1995-06-06
申请号：US224006
申请日：1994-04-05
CPC分类号： G01R1/07328
摘要： A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment. The latches are part of a guide post assembly for guiding vertical travel of the top plate during vacuum cycling of the test fixture. An optical alignment system in combination with the movable bearings provides a quick and easy means of aligning the board and the probes with extremely high accuracy.
摘要翻译： 用于测试电路板的测试夹具在固定探针板和可移动顶板之间具有真空室。 位于夹具象限中的可分离的可调直线轴承提供顶板和探针板之间的平行对准。 探头板和顶板之间的连续真空密封件绕过轴承，因此轴承位于真空区域之外。 探针板中的弹簧加载的测试探针延伸穿过顶板中的孔，用于进入被测电路板。 当顶板在真空下向下移动探针时，探针接触板。 顶板通过延伸穿过直线轴承的单独的快速释放闩锁销固定到探针板上。 移动的顶板承载用于将板安装到顶板的固定工具销。 可移动轴承座支撑轴承。 顶板可移动以使板与测试探针对准。 顶板，闩锁销，轴承和轴承座可作为相对于探针板的单元移动。 在顶板与探针对准以补偿电路板批次之间的技术偏移之后，快速释放闩锁被接合以保持对准。 闩锁是用于在测试夹具的真空循环期间引导顶板的垂直行进的引导柱组件的一部分。 与可移动轴承结合的光学对准系统提供了一种快速且简便的方法，可以极高的精度对准电路板和探头。
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17.发明授权
公开(公告)号：US5247246A
公开(公告)日：1993-09-21
申请号：US698724
申请日：1991-05-10
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R31/316 , G01R1/0425
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it includes a composite flex-circuit material with individual contacts including flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. The translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其包括具有单独触头的复合柔性电路材料，包括柔性弹簧状金属化塑料指状物。 测试模块上的触点可以直接地与IC封装上的引线相接触，或者它们接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。
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公开(公告)号：US5391995A
公开(公告)日：1995-02-21
申请号：US189693
申请日：1994-02-01
申请人： Charles J. Johnston , Mark A. Swart
发明人： Charles J. Johnston , Mark A. Swart
CPC分类号： G01R1/06722
摘要： A spring biased test probe for testing electrical printed circuit boards includes an elongated tubular barrel having an open end, and a compression spring within a spring seating end of the barrel, opposite from its open end. A plunger inserted in the barrel reciprocates during testing, sliding within the barrel and biased by the spring pressure. The plunger includes a forward end portion outside the barrel, a slidable tail portion that contacts the spring and slides within a barrel, and an intermediate twisted portion between the forward end and the tail portion of the plunger. The forward end of the plunger has a probe tip configured to make frictional pressure contact with the board to be tested. The intermediate portion is twisted about its axis to form a spiral with helical grooves contacted by circumferentially spaced apart crimps in the side of the barrel, adjacent the open end of the barrel. The plunger is rotated about its axis by its contact with the crimps as the plunger travels axially in the barrel. The twisted intermediate section of the plunger and the forward end of the plunger extend outside the barrel which is contained in an elongated tubular outer receptacle. The forward end of the plunger includes an elongated enlarged diameter guide bearing section between the probe tip and the twisted section of the plunger.
摘要翻译： 用于测试电气印刷电路板的弹簧偏置测试探针包括具有开口端的细长管状筒体和与其开口端相对的筒体的弹簧座端部内的压缩弹簧。 插入桶中的柱塞在测试期间往复运动，在筒内滑动并被弹簧压力偏压。 柱塞包括在筒外部的前端部分，可滑动的尾部部分，其接触弹簧并在筒体内滑动，以及在柱塞的前端部和尾部之间的中间扭转部分。 柱塞的前端具有构造成与要测试的板摩擦压力接触的探针尖端。 中间部分围绕其轴线扭转以形成螺旋形，螺旋形沟槽与筒体的开口端相邻，在圆筒的侧面中周向间隔开的卷曲接触。 当柱塞在筒体中轴向移动时，柱塞通过其与卷曲部的接触而绕其轴线旋转。 柱塞的扭转中间部分和柱塞的前端延伸到容纳在细长管状外部容器中的筒的外部。 柱塞的前端包括在探针尖端和柱塞扭转部分之间的细长的扩大直径的导向轴承部分。
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公开(公告)号：US5300881A
公开(公告)日：1994-04-05
申请号：US84755
申请日：1993-06-30
CPC分类号： G01R1/07328
摘要： A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured, to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment.
摘要翻译： 用于测试电路板的测试夹具在固定探针板和可移动顶板之间具有真空室。 位于夹具象限中的可分离的可调直线轴承提供顶板和探针板之间的平行对准。 探头板和顶板之间的连续真空密封件绕过轴承，因此轴承位于真空区域之外。 探针板中的弹簧加载的测试探针延伸穿过顶板中的孔，用于进入被测电路板。 当顶板在真空下向下移动探针时，探针接触板。 顶板通过延伸穿过直线轴承的单独的快速释放闩锁销固定到探针板上。 移动的顶板承载用于将板安装到顶板的固定工具销。 可移动轴承座支撑轴承。 顶板可移动以使板与测试探针对准。 顶板，闩锁销，轴承和轴承座可作为相对于探针板的单元移动。 在顶板与探针对准以补偿电路板批次之间的技术偏移之后，快速释放闩锁被接合以保持对准。
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公开(公告)号：US5289117A
公开(公告)日：1994-02-22
申请号：US998554
申请日：1992-12-30
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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