公开(公告)号：US20170092565A1

公开(公告)日：2017-03-30

申请号：US15283013

申请日：2016-09-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.