公开(公告)号：US12029008B2

公开(公告)日：2024-07-02

申请号：US17602100

申请日：2020-04-13

Applicant: The Penn State Research Foundation

Inventor： Bladimir Ramos Alvarado ,  Carlos Ulises Gonzalez Valle ,  Luis Enrique Paniagua Guerra ,  Jonathan Veli

IPC: H05K7/20 ,  B33Y80/00 ,  F28D1/02 ,  F28D21/00 ,  F28F3/12 ,  F28F7/02 ,  H01L23/367 ,  H01L23/473

CPC classification number: H05K7/20263 ,  F28D1/0246 ,  F28F3/12 ,  F28F7/02 ,  H01L23/3677 ,  H01L23/4735 ,  H05K7/20236 ,  H05K7/20254 ,  H05K7/20272 ,  B33Y80/00 ,  F28D2021/0029

Abstract: A liquid-cooled heat sink has three parts: the water block, the X-clamp, and a copper plate. The water block has an inlet connected to a resin shell. Inside the shell, a fractal inlet manifold divides the inlet coolant flow into several sub streams that eventually exit in the form of uniformly distributed liquid jets through small nozzles/microjets at the bottom of the shell. The union between the shell and the copper plate forms a flood chamber, where the jets impinge on the copper plate, dissipating the heat supplied to the copper plate in contact with the heat source. The warm liquid is removed from the flood chamber through an outlet manifold embedded with the resin shell.

公开(公告)号：US11978690B2

公开(公告)日：2024-05-07

申请号：US17860561

申请日：2022-07-08

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa

IPC: H01L23/40 ,  B81B3/00 ,  G06F1/20 ,  H01L23/473

CPC classification number: H01L23/4735 ,  B81B3/0021 ,  G06F1/20 ,  H01L23/40 ,  B81B2201/034 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2207/99

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.

公开(公告)号：US11968802B2

公开(公告)日：2024-04-23

申请号：US18122431

申请日：2023-03-16

Applicant: ICEOTOPE GROUP LIMITED

Inventor： David Amos ,  Neil Edmunds ,  Andrew Young ,  Jasper Kidger ,  Nathan Longhurst

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/473

CPC classification number: H05K7/20236 ,  H01L23/3677 ,  H01L23/473 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/20927 ,  H01L23/4735 ,  H05K7/20254 ,  H05K7/20272

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

公开(公告)号：US11950394B2

公开(公告)日：2024-04-02

申请号：US17499324

申请日：2021-10-12

Applicant: GE AVIATION SYSTEMS LLC

Inventor： Brian Magann Rush ,  Christopher James Kapusta ,  David Richard Esler ,  Liang Yin ,  Richard Anthony Eddins ,  Judd Everett Swanson ,  Liqiang Yang

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H05K7/20272 ,  H05K7/20936

Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

公开(公告)号：US11917796B2

公开(公告)日：2024-02-27

申请号：US17777242

申请日：2020-11-18

Applicant: ICEOTOPE GROUP LIMITED

Inventor： Nathan Longhurst ,  Jason Matteson ,  David Amos

IPC: H05K7/20 ,  H01L23/473 ,  H05K1/02

CPC classification number: H05K7/20772 ,  H05K7/20236 ,  H01L23/473 ,  H01L23/4735 ,  H05K1/0203 ,  H05K7/20254 ,  H05K2201/066

Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

公开(公告)号：US11812592B1

公开(公告)日：2023-11-07

申请号：US17962034

申请日：2022-10-07

Applicant: Smart Wires Inc.

Inventor： Haroon Inam ,  Ali Farahani

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/4735 ,  H05K7/20254 ,  H05K7/20272

Abstract: A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.

公开(公告)号：US11804418B2

公开(公告)日：2023-10-31

申请号：US16246311

申请日：2019-01-11

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Je-Young Chang ,  Jae Kim ,  Ravindranath Mahajan

IPC: H05K7/20 ,  H01L23/433 ,  F28F3/12 ,  F28F9/00 ,  H01L23/367 ,  H01L23/473 ,  F28F9/02 ,  F28D21/00

CPC classification number: H01L23/4336 ,  F28F3/12 ,  F28F9/001 ,  F28F9/0202 ,  H01L23/367 ,  H01L23/4735 ,  H05K7/20254 ,  F28D2021/0029 ,  F28F2260/02

Abstract: A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.

公开(公告)号：US11710678B2

公开(公告)日：2023-07-25

申请号：US16369801

申请日：2019-03-29

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Leonard Eugene Fennell ,  Vikram Mukundan

IPC: F25B21/02 ,  H01L41/00 ,  F04B17/00 ,  H01L23/473 ,  F04B53/10 ,  F04B43/04 ,  F04B45/047 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H05K7/20 ,  F04D33/00 ,  H04M1/02 ,  F04B43/09 ,  H01L23/46 ,  H01L23/42 ,  F04B45/04 ,  H10N30/00 ,  H10N30/20 ,  H10N30/80 ,  H10N35/80

CPC classification number: H01L23/4735 ,  B06B1/06 ,  F04B17/003 ,  F04B43/04 ,  F04B43/046 ,  F04B43/095 ,  F04B45/043 ,  F04B45/047 ,  F04B53/1077 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/46 ,  H01L23/473 ,  H04M1/0202 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/2039 ,  H05K7/20272 ,  H05K7/20281 ,  H10N30/00 ,  H10N30/20 ,  H10N30/204 ,  H10N30/2047 ,  H10N30/80 ,  H10N35/80 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2321/0212 ,  F25B2321/0252

Abstract: A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

公开(公告)号：US20230215781A1

公开(公告)日：2023-07-06

申请号：US18092999

申请日：2023-01-04

Applicant: CORNING RESEARCH & DEVELOPMENT CORPORATION

Inventor： James Scott Sutherland

IPC: H01L23/473 ,  B82Y30/00

CPC classification number: H01L23/4735 ,  B82Y30/00

Abstract: Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surface, and further defines a channel extending within the seal. After an application of heat, the layer of nano-particles forms the seal such that the device is fluid impermeable, so as to allow a coolant fluid to enter through the first hole to flow through the channel to reduce or remove the heat generated by the electronics equipment associated with the electronics surface.

公开(公告)号：US09997434B2

公开(公告)日：2018-06-12

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  H01L23/34 ,  H01L25/065 ,  H01L23/02 ,  H01L25/18 ,  H01L23/44 ,  H01L23/467 ,  H01L23/48

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.