公开(公告)号：US10957624B2

公开(公告)日：2021-03-23

申请号：US16840305

申请日：2020-04-03

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20230207426A1

公开(公告)日：2023-06-29

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  H01L21/4871 ,  H01L23/473 ,  H01L21/4882 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281 ,  F28F2260/02

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US12255123B2

公开(公告)日：2025-03-18

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US10665530B2

公开(公告)日：2020-05-26

申请号：US16373569

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20200335425A1

公开(公告)日：2020-10-22

申请号：US16840305

申请日：2020-04-03

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US10096537B1

公开(公告)日：2018-10-09

申请号：US15475074

申请日：2017-03-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/34 ,  H01L23/427 ,  F28D15/04

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.

公开(公告)号：US09953899B2

公开(公告)日：2018-04-24

申请号：US15283013

申请日：2016-09-30

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  H05K7/20 ,  F28F3/12 ,  F28F13/06

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US11456235B1

公开(公告)日：2022-09-27

申请号：US17174218

申请日：2021-02-11

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20190229038A1

公开(公告)日：2019-07-25

申请号：US16373569

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H05K7/20 ,  H01L21/48 ,  F28F13/06 ,  F28F3/12

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US20180337110A1

公开(公告)日：2018-11-22

申请号：US15951481

申请日：2018-04-12

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  H01L21/48 ,  F28F13/06 ,  F28F3/12 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  F28F2260/02 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/473 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.