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公开(公告)号:US20190092993A1
公开(公告)日:2019-03-28
申请号:US15716810
申请日:2017-09-27
Applicant: Momentive Performance Materials Inc.
Inventor: Sandeep Naik , Pranabesh Dutta , Vinu Krishnan Appukuttan , Anubhav Saxena , Takanashi Masanori
CPC classification number: C09K5/10 , B33Y10/00 , C08K3/22 , C08K3/38 , C08K2003/2227 , C08K2003/385 , C09D183/08 , C09J183/08 , C08L83/04
Abstract: A thermally conductive silicone composition is shown and described herein. The thermally conductive silicone composition comprises (A) an ionically modified siloxane, and (B) a thermally conductive filler comprising a first filler and a second filler, where the first filler and/or the second filler comprises a plurality of filler types, the plurality of filler types differing from one another in terms of particle size and/or morphology. The ionically modified siloxane may function as a dispersing aid or wetter for efficient dispersion of thermal conducting organic and inorganic fillers to achieve high thermal conductivity.