公开(公告)号：US20240352246A1

公开(公告)日：2024-10-24

申请号：US18687348

申请日：2022-08-31

申请人： Trinseo Europe GmbH

发明人： Mark C. Gatman ,  Roger Neil Caldwell

IPC分类号： C08L33/12 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08L67/00

CPC分类号： C08L33/12 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08L67/00 ,  C08J2333/12 ,  C08K2003/2227 ,  C08K2003/387 ,  C08L2201/02

摘要： Resin compositions include a) about 35 wt % to about 90 wt % of an primary acrylic component or about 10 wt % to about 90 wt % of a polyester component; b) about 0 wt % to about 10 wt % of a comonomer; and c) about 10 wt % to about 15 wt % of an organo-phosphorus/nitrogen flame resistant composition. Methods include i.) preparing an acrylic resin composition including: a) about 35 wt % to about 90 wt % of an primary acrylic component or about 10 wt % to about 90 wt % of a polyester component; b) about 0-10 wt % of a comonomer; and c) about 10-15 wt % of an organo-phosphorus/nitrogen flame resistant composition; and ii) processing the acrylic resin by continuous casting to form a sheet or surface.

公开(公告)号：US20240343963A1

公开(公告)日：2024-10-17

申请号：US18579964

申请日：2022-07-12

申请人： Solvay Specialty Polymers USA, LLC

发明人： Emmanuel ANIM-DANSO ,  Lee CARVELL ,  Stéphane JEOL

IPC分类号： C09K5/14 ,  C08K3/38 ,  C08K7/06

CPC分类号： C09K5/14 ,  C08K3/38 ,  C08K7/06 ,  C08K2003/385 ,  C08K2201/001

摘要： Polymer compositions are provided, and articles made therefrom. The polymer compositions comprise from 25 to 50 wt. % of a thermoplastic polymer; from 10 to 45 wt. % of a thermally conductive filler; from 15 to 30 wt. % of an electrically conductive carbon fiber; and less than 5 wt. % additives. The polymer composition is substantially free of glass fibers. The polymer compositions described herein surprisingly exhibit significantly improved thermal conductivity relative to analogous polymer compositions in which the carbon fiber is replaced by glass fiber. Further, even though carbon fiber has a significantly higher electrical conductivity relative to glass fiber, the polymer compositions exhibit no appreciable loss of volume resistivity relative to analogous polymer compositions in which carbon fiber is replaced by glass fiber.

公开(公告)号：US12012543B2

公开(公告)日：2024-06-18

申请号：US16651109

申请日：2018-10-26

申请人： LG CHEM, LTD.

发明人： Sai Bom Park ,  Jin Kyu Lee

IPC分类号： C09K5/14 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08K7/04 ,  F28F21/06

CPC分类号： C09K5/14 ,  C08J5/18 ,  C08K3/22 ,  C08K3/38 ,  C08K7/04 ,  F28F21/067 ,  C08J2383/04 ,  C08K2003/2272 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/01 ,  C08K2201/011 ,  F28F2255/06

摘要： The present application provides a composite material and a method for producing the same. The present application can provide a composite material having excellent other necessary properties such as impact resistance or processability, as well as excellent heat conduction characteristics as a tight heat transfer network is formed therein by an anisotropic heat-conductive filler.

公开(公告)号：US20240158594A1

公开(公告)日：2024-05-16

申请号：US18509450

申请日：2023-11-15

申请人： SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

发明人： Kai GAO ,  Ying WANG ,  Shuai LIANG ,  Arthur L. ADAM, JR. ,  Jia LIU ,  Cassandra TUBBS ,  Balaji GOPALAN ,  Aaron KESSMAN ,  Chuanping LI ,  Fei WANG

IPC分类号： C08J9/00 ,  C08G77/08 ,  C08G77/20 ,  C08J9/14 ,  C08K3/22 ,  C08K3/26 ,  C08K3/34 ,  C08K3/38

CPC分类号： C08J9/0066 ,  C08G77/08 ,  C08G77/20 ,  C08J9/142 ,  C08K3/22 ,  C08K3/26 ,  C08K3/34 ,  C08K3/38 ,  C08J2203/12 ,  C08J2383/07 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2003/387

摘要： The present disclosure related to a silicone-based foam may include a component A and a component B, where the component A may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, and a third filler component that may include calcium carbonate, and where the component B may include a silicone-based matrix component, a first filler component that may include alumina trihydrate, a second filler component that may include perlite, a third filler component that may include calcium carbonate, and a fourth filler component that may include zinc borate. The silicone-based foam may have a V-0 flammability rating as measured according to ASTM D3801.

公开(公告)号：US20240150548A1

公开(公告)日：2024-05-09

申请号：US18279003

申请日：2022-02-03

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Patricia J. Tegeder ,  Martin Engler ,  Ricardo Mizoguchi Gorgoll ,  Jens Eichler ,  Stefanie Wildhack

IPC分类号： C08K3/38 ,  C08G65/333 ,  C08G77/46 ,  C08K9/02 ,  C08L71/02

CPC分类号： C08K3/38 ,  C08G65/33303 ,  C08G77/46 ,  C08K9/02 ,  C08L71/02 ,  C08K2003/385 ,  C08K2201/014 ,  C08L2203/20

摘要： A curable composition comprises oxidized boron nitride particles and a polyaziridine. Each oxidized boron nitride particle comprises a hydrated boron oxide surface layer disposed on a boron nitride core. A method of curing and a cured reaction product are also disclosed.

公开(公告)号：US20240117126A1

公开(公告)日：2024-04-11

申请号：US18276285

申请日：2022-02-15

申请人： TAKAGI CHEMICALS, INC.

发明人： Noriaki TAKAGI ,  Masakuni TAKAGI ,  Yuusuke NAGATANI ,  Daisuke WATANABE ,  Kazuo MATSUYAMA

IPC分类号： C08J3/20 ,  C08K3/04 ,  C08K3/38

CPC分类号： C08J3/203 ,  C08K3/04 ,  C08K3/38 ,  C08J2371/12 ,  C08J2377/06 ,  C08J2381/02 ,  C08J2471/12 ,  C08J2477/06 ,  C08J2481/02 ,  C08K2003/385

摘要： A high filler-loaded thermally conductive thin sheet is obtained by uniformly dispersing a mixture containing organic polymer particles and highly thermally conductive filler particles using a pulverizer or a mixer to obtain a powder composition, conveying the powder composition at a constant thickness between two belts of a double belt press device, and continuously heating and pressurizing the powder composition at a temperature higher than or equal to a deflection temperature under load, melting point, or a glass transition temperature of the organic polymer and at a specific pressure and then cooling and solidifying the powder composition in the double belt press device.

公开(公告)号：US20240110038A1

公开(公告)日：2024-04-04

申请号：US18243372

申请日：2023-09-07

申请人： PROMERUS, LLC

发明人： PRAMOD KANDANARACHCHI ,  DOUG SKILSKYJ

IPC分类号： C08K3/38 ,  C08F232/08 ,  C08J5/18 ,  C08J5/24 ,  C08K7/00

CPC分类号： C08K3/38 ,  C08F232/08 ,  C08J5/18 ,  C08J5/244 ,  C08J5/249 ,  C08K7/00 ,  C08J2345/00 ,  C08K2003/385 ,  C08K2201/005

摘要： Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.

公开(公告)号：US20240110003A1

公开(公告)日：2024-04-04

申请号：US18243390

申请日：2023-09-07

申请人： PROMERUS, LLC

发明人： RUSLAN BURTOVYY ,  PRAMOD KANDANARACHCHI ,  CHERYL BURNS ,  CAROLYN SCHERGER

IPC分类号： C08G61/08 ,  C08F236/20 ,  C08K3/38 ,  C08K5/3492 ,  C08K5/5313 ,  C08L65/00 ,  H01Q1/38

CPC分类号： C08G61/08 ,  C08F236/20 ,  C08K3/38 ,  C08K5/3492 ,  C08K5/5313 ,  C08L65/00 ,  H01Q1/38 ,  C08G2261/3324 ,  C08K2003/385 ,  C08K2201/005 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/206

摘要： Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers optionally at least one of which monomer contains an additional unpolymerized ethylenic bond, organophosphorus compound, optionally hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to excellent thermal and dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention has a UL-94 rating of V-0, dielectric constant (Dk) less than 2.7 and dielectric dissipation factor (Df) of less than 0.0009.

公开(公告)号：US11945931B1

公开(公告)日：2024-04-02

申请号：US18280250

申请日：2021-12-01

申请人： SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES

发明人： Weibang Lv ,  Shuxuan Qu ,  Jiaqi Xi

IPC分类号： C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00

CPC分类号： C08K3/041 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K7/06 ,  C08K9/00 ,  C08K2003/0806 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/011 ,  Y02W30/62

摘要： A recyclable nano composite, a preparation method, and an application thereof are provided. The preparation method includes providing a reinforcement material including a conductive material, or, a combination of the conductive material and an insulating material; directly mixing the reinforcement material with a matrix material, or, molding the reinforcement material to form a film, fiber or three-dimensional network structure formed by the reinforcement material, and then compounding the film, fiber or three-dimensional network structure with the matrix material to obtain the recyclable nano composite. The present disclosure further discloses a recycling method of a reinforcement material. The recyclable nano composite provided by the present disclosure has high strength, high toughness, conductivity, electromagnetic shielding and other properties; furthermore, by simple treatment, the reinforcement material can be recycled.

公开(公告)号：US11939450B2

公开(公告)日：2024-03-26

申请号：US17575695

申请日：2022-01-14

申请人： DAIKIN INDUSTRIES, LTD.

发明人： Hirofumi Mukae ,  Hirokazu Komori ,  Masaji Komori ,  Hideki Kono ,  Ayane Nakaue

IPC分类号： C08K3/38 ,  B32B15/082 ,  B32B27/20 ,  B32B27/30 ,  C08F214/26 ,  H05K1/03 ,  H05K1/02

CPC分类号： C08K3/38 ,  B32B15/082 ,  B32B27/20 ,  B32B27/304 ,  C08F214/262 ,  C08F214/265 ,  H05K1/0373 ,  B32B2250/02 ,  B32B2264/10 ,  B32B2307/302 ,  B32B2457/08 ,  C08K2003/385 ,  C08K2201/005 ,  H05K1/0237

摘要： A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.