CIRCUIT MODULE
    11.
    发明申请
    CIRCUIT MODULE 有权
    电路模块

    公开(公告)号:US20140045546A1

    公开(公告)日:2014-02-13

    申请号:US14057000

    申请日:2013-10-18

    Inventor: Syuichi ONODERA

    Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.

    Abstract translation: 在电路模块中,即使从安装基板的发送电极输出到分路器的发送端子的发送信号泄漏到接地电极中,泄漏到接地电极的发送信号流入通过导体连接的通路 接地电极的边缘部分靠近传输电极并连接到母板的接地线。 因此,防止从发送电极输出并漏入接地电极的发送信号沿着接地电极的边缘部朝向接收电极侧行进。 因此,改善了在安装有分离器的安装基板上设置的传输电极和接收电极之间的隔离特性。

Patent Agency Ranking