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    WIRING SUBSTRATE
    1.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240334598A1

    公开(公告)日：2024-10-03

    申请号：US18614865

    申请日：2024-03-25

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Yuki KOBAYASHI ,  Tomoo YAMASAKI

    IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10

    CPC classification number: H05K1/09 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/108 ,  H05K2201/0209 ,  H05K2201/0338 ,  H05K2203/072 ,  H05K2203/0723

    Abstract: A wiring substrate includes a first wiring layer, an insulation layer covering a side surface of the first wiring layer and exposing part of the first wiring layer, and a second wiring layer formed on the first wiring layer exposed from the insulation layer. The insulation layer includes a resin and a filler. The insulation layer includes an upper surface having a structure in which the filler is exposed from the resin. The second wiring layer includes a first metal film, covering the upper surface of the insulation layer and the wiring layer exposed from the insulation layer, and a metal layer, formed above the first metal film. The first metal film is formed from a CuNiTi alloy and has a Ni content rate of 5 wt % or greater and 30 wt % or less and a Ti content rate of 5 wt % or greater and 15 wt % or less.

    SEMICONDUCTOR PACKAGE
    8.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240136267A1

    公开(公告)日：2024-04-25

    申请号：US18277654

    申请日：2022-02-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hyun Sun LEE ,  Dae Sung MOON ,  Dong Hun JOUNG

    IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11

    CPC classification number: H01L23/49827 ,  H01L24/32 ,  H05K1/113 ,  H05K1/115 ,  H01L2224/32235 ,  H01L2924/1432

    Abstract: A semiconductor package according to an embodiment includes a first insulating layer; and a first through electrode part passing through the first insulating layer and having a shape elongated in a first direction; wherein the first through electrode part includes a plurality of first through electrodes spaced apart from each other in a second direction perpendicular to the first direction and a thickness direction; wherein at least one of the plurality of first through electrodes includes a first sub through electrode and a second sub through electrode spaced apart from each other in the first direction; and wherein at least one of the first sub through electrode and the second sub through electrode has a width in the first direction greater than a width in the second direction.

    ELECTRONIC DEVICE
    10.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240114619A1

    公开(公告)日：2024-04-04

    申请号：US18073592

    申请日：2022-12-02

    Applicant: InnoLux Corporation

    Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Chien-Feng LI ,  Chia-Lin YANG

    IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K1/113 ,  H05K3/4038 ,  H05K3/4673 ,  H05K2201/0266

    Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

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