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公开(公告)号：US11463050B2
公开(公告)日：2022-10-04
申请号：US16832295
申请日：2020-03-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yusuke Naniwa , Hideki Muto , Hiroshi Nishikawa , Takashi Watanabe , Akiko Itabashi
Abstract: A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.
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公开(公告)号：US10812122B2
公开(公告)日：2020-10-20
申请号：US16702712
申请日：2019-12-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US09991909B2
公开(公告)日：2018-06-05
申请号：US15297321
申请日：2016-10-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
CPC classification number: H04B1/006 , H03H7/0115 , H03H7/38 , H03H7/46 , H03H9/54 , H03H9/64 , H03H9/70 , H03H2250/00
Abstract: A radio-frequency module includes switch elements, first signal paths, band pass filters, first matching circuits, second signal paths, and second matching circuits. Each of the first signal paths is connected between one end of a corresponding one of the switch elements and an antenna terminal. Each of the band pass filters is connected to a corresponding one of the first signal paths and allows a radio-frequency signal of one of the plurality of frequency bands to pass therethrough. Each of the first matching circuits is connected to a corresponding one of the first signal paths. Each of the second signal paths is connected to a corresponding one of the switch elements. Each of the second matching circuits is connected to a corresponding one of the second signal paths. A component included in the first matching circuits and a component included in the second matching circuits are electromagnetically coupled.
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Patent Agency Ranking
公开(公告)号：US11387856B2
公开(公告)日：2022-07-12
申请号：US17022358
申请日：2020-09-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US11152968B2
公开(公告)日：2021-10-19
申请号：US17153917
申请日：2021-01-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
Abstract: A radio-frequency module includes a first terminal configured to receive a signal from an antenna, a substrate, a first filter element on the substrate, a first switch including a first switch terminal and a second switch terminal connectable to the first switch terminal, and connected between the first terminal and the first filter element, and a second switch including a third switch terminal. The first filter element is connected between the second switch terminal and the third switch terminal, the first switch and the second switch are included in a semiconductor chip, and the semiconductor chip is on the substrate.
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公开(公告)号：US10608682B2
公开(公告)日：2020-03-31
申请号：US16567201
申请日：2019-09-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
Abstract: An amplifier circuit unit of a radio frequency module is mounted on a substrate with a first external terminal interposed therebetween, a switch circuit unit is mounted on the substrate with a second external terminal interposed therebetween, and a matching circuit unit is mounted on the substrate with a first terminal and a second terminal interposed therebetween. The first terminal is electrically connected to the second external terminal of the switch circuit unit, and the second terminal is electrically connected to the first external terminal of the amplifier circuit unit. When viewed from a direction perpendicular to one main surface of the substrate, the first terminal is superposed with the second external terminal of the switch circuit unit, and the second terminal is superposed with the first external terminal of the amplifier circuit unit.
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公开(公告)号：US10211864B2
公开(公告)日：2019-02-19
申请号：US15851902
申请日：2017-12-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US09887718B2
公开(公告)日：2018-02-06
申请号：US15296126
申请日：2016-10-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi Watanabe
CPC classification number: H04B1/16 , H03H7/38 , H03H9/64 , H03H9/72 , H03H11/362 , H03H2007/386 , H03H2250/00
Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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