Surface profile estimation and bump detection for autonomous machine

    公开(公告)号:US11900629B2

    公开(公告)日:2024-02-13

    申请号:US18174770

    申请日:2023-02-27

    Abstract: In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g., an autonomous or semi-autonomous vehicle—to help in navigating the environment, and/or the profile may be used to detect bumps, humps, and/or other protuberances along the driving surface, in addition to a location, orientation, and geometry thereof.

    SURFACE PROFILE ESTIMATION AND BUMP DETECTION FOR AUTONOMOUS MACHINE APPLICATIONS

    公开(公告)号:US20230230273A1

    公开(公告)日:2023-07-20

    申请号:US18174770

    申请日:2023-02-27

    Abstract: In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g., an autonomous or semi-autonomous vehicle—to help in navigating the environment, and/or the profile may be used to detect bumps, humps, and/or other protuberances along the driving surface, in addition to a location, orientation, and geometry thereof.

    Visual odometry in autonomous machine applications

    公开(公告)号:US11435756B2

    公开(公告)日:2022-09-06

    申请号:US17108965

    申请日:2020-12-01

    Abstract: Systems and methods for performing visual odometry more rapidly. Pairs of representations from sensor data (such as images from one or more cameras) are selected, and features common to both representations of the pair are identified. Portions of bundle adjustment matrices that correspond to the pair are updated using the common features. These updates are maintained in register memory until all portions of the matrices that correspond to the pair are updated. By selecting only common features of one particular pair of representations, updated matrix values may be kept in registers. Accordingly, matrix updates for each common feature may be collectively saved with a single write of the registers to other memory. In this manner, fewer write operations are performed from register memory to other memory, thus reducing the time required to update bundle adjustment matrices and thus speeding the bundle adjustment process.

    RAPID VISUAL ODOMETRY IN AUTONOMOUS MACHINE APPLICATIONS

    公开(公告)号:US20210165418A1

    公开(公告)日:2021-06-03

    申请号:US17108965

    申请日:2020-12-01

    Abstract: Systems and methods for performing visual odometry more rapidly. Pairs of representations from sensor data (such as images from one or more cameras) are selected, and features common to both representations of the pair are identified. Portions of bundle adjustment matrices that correspond to the pair are updated using the common features. These updates are maintained in register memory until all portions of the matrices that correspond to the pair are updated. By selecting only common features of one particular pair of representations, updated matrix values may be kept in registers. Accordingly, matrix updates for each common feature may be collectively saved with a single write of the registers to other memory. In this manner, fewer write operations are performed from register memory to other memory, thus reducing the time required to update bundle adjustment matrices and thus speeding the bundle adjustment process.

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