公开(公告)号：US20220384943A1

公开(公告)日：2022-12-01

申请号：US17664089

申请日：2022-05-19

Applicant: NXP B.V.

Inventor： Mustafa Acar ,  Philipp Franz Freidl ,  Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman ,  Rajesh Mandamparambil

IPC: H01Q1/48

Abstract: A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.