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    LOW LOSS TRANSMISSION LINE WITH STEPPED STRUCTURES
    3.
    发明公开
    LOW LOSS TRANSMISSION LINE WITH STEPPED STRUCTURES 审中-公开

    公开(公告)号：US20230361443A1

    公开(公告)日：2023-11-09

    申请号：US17662572

    申请日：2022-05-09

    申请人： NXP B.V.

    发明人： Mustafa Acar ,  Danny Wayling Chang ,  Dominicus Martinus Wilhelmus Leenaerts ,  Philipp Franz Freidl

    IPC分类号： H01P1/02 ,  H01P3/02

    CPC分类号： H01P3/026 ,  H01P1/022

    摘要： A transmission line includes a signal conductor and one or more return conductors, one or more of which having a stepped multi-layer structure. The return conductors may be disposed at opposite sides of the signal conductor. The return conductors may be multi-layer structures. At least some layers of each return conductor may have a stepped arrangement that defines a curve, such as an exponential curve. Additionally or alternatively, the signal conductor may be a stepped multi-layer structure, where at least some layers of the signal conductor may define a curve, such as an exponential curve. The signal conductor may be disposed at one or more upper layers of the transmission line or may be embedded at one or more layers near the center of the transmission line.

    RF component and method
    4.
    发明授权
    RF component and method 有权

    公开(公告)号：US12114472B2

    公开(公告)日：2024-10-08

    申请号：US18059611

    申请日：2022-11-29

    申请人： NXP B.V.

    发明人： Philipp Franz Freidl ,  Mustafa Acar ,  Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman

    IPC分类号： H05K9/00 ,  H01P3/08 ,  H01Q1/52

    CPC分类号： H05K9/0081 ,  H01P3/08 ,  H01Q1/526 ,  H05K9/0037

    摘要： A Radio Frequency, “RF”, component and a method of making the same. The component includes a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also includes a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier includes a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member includes a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.

    RF COMPONENT AND METHOD
    5.
    发明公开
    RF COMPONENT AND METHOD 审中-公开

    公开(公告)号：US20230189492A1

    公开(公告)日：2023-06-15

    申请号：US18059611

    申请日：2022-11-29

    申请人： NXP B.V.

    发明人： Philipp Franz Freidl ,  Mustafa Acar ,  Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman

    IPC分类号： H05K9/00 ,  H01Q1/52 ,  H01P3/08

    CPC分类号： H05K9/0081 ,  H01Q1/526 ,  H01P3/08

    摘要： A Radio Frequency, “RF”, component and a method of making the same. The component comprises a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also comprises a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier comprises a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member comprises a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.

    RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
    9.
    发明公开
    RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE 审中-公开

    公开(公告)号：US20230402410A1

    公开(公告)日：2023-12-14

    申请号：US18315515

    申请日：2023-05-11

    申请人： NXP B.V.

    发明人： Mustafa Acar ,  Paul Mattheijssen ,  Philipp Franz Freidl ,  Rajesh Mandamparambil ,  Jan Willem Bergman

    IPC分类号： H01L23/66 ,  H01L25/16

    CPC分类号： H01L23/66 ,  H01L25/16 ,  H01L2223/6644

    摘要： An RF package assembly includes a stacked package-on-package arrangement of a first substrate and a second substrate. Each of the first and second substrates include RF signal pads and ground pads. An interface region between the stacked substrates couples the RF signal pads and ground pads of the first substrate to corresponding pads of the second substrate. The interface region includes galvanic connection regions providing a galvanic connection between the each of the first substrate ground pads and each of the corresponding second substrate ground pads. The interface region includes dielectric regions between each of the first substrate RF signal pads and the corresponding second substrate RF signal pads so that RF signals transmitted between the two substrates are capacitively coupled.