摘要:
Provided are a film formation apparatus and a film formation method which may control with accuracy the thickness of a thin film formed on the film formation object. A film formation apparatus includes a moving part (film formation source unit) for moving a film formation source between a predetermined film formation waiting position and a predetermined film forming position is provided, and the moving part holds a quartz oscillator for measurement and a quartz oscillator for calibration so that their relative positions with respect to the film formation source are maintained. And a calibration step for calibrating a monitored value of the quartz oscillator for measurement, using a monitored value of the quartz oscillator for calibration, is performed in a middle of the film forming step of forming the film on the film formation object.
摘要:
Provided are an alignment method and an alignment apparatus, in which the number of times to carry out alignment operation is reduced to reduce damage of a substrate and a mask and improve the productivity of evaporation using the mask. Vibrations in the direction of gravity of a substrate immediately after the substrate is brought in are measured by a laser vibrometer. Based on the obtained vibration data, a vibration control portion generates an antiphase vibrational wave. After the vibrational wave is applied to the substrate to reduce the vibrations of the substrate, the alignment between the substrate and a mask is carried out.