Systems and methods for product level tracking of sheet product rolls

    公开(公告)号:US12102270B2

    公开(公告)日:2024-10-01

    申请号:US18125759

    申请日:2023-03-24

    CPC classification number: A47K10/38 G01B11/14 A47K2010/389

    Abstract: Systems, devices, and methods for providing a sheet product dispenser with automated product level tracking functionality are provided herein. Various product level sensors are disclosed herein including a product level sensor configured to emit a signal toward an outer circumference of a sheet product roll on a spindle extending along a longitudinal axis and to receive a reflected signal. The product level sensor is positioned a radial distance away from the spindle and aimed to emit the signal in a direction that is not parallel and not perpendicular to the longitudinal axis. The product level sensor detects a parameter of the reflected signal corresponding to the distance between the product level sensor and the sheet product roll. Other example embodiments include mechanical product level sensors. Various communication protocols may be employed to limit transmission of data to conserve battery life while still maintaining desired communication functionality.

    Microscope and method for determining a distance to a sample reference plane

    公开(公告)号:US12055380B2

    公开(公告)日:2024-08-06

    申请号:US17375110

    申请日:2021-07-14

    CPC classification number: G01B11/14 G02B21/241 G02B21/26 G02B21/365

    Abstract: A method for determining a distance of a sample reference plane of a sample carrier from a reference plane of a microscope, the microscope including a sample stage for the sample carrier and a camera, comprises the following steps: taking an overview image of the sample carrier by means of the camera; evaluating the overview image and thus detecting at least one characteristic of the sample carrier; ascertaining contextual data of the characteristic from a data set; and determining the distance of the sample reference plane from the reference plane based on the characteristic and the contextual data of the sample carrier. A microscope configured to determine the distance of the sample reference plane of the sample carrier from the reference plane is also described.

    Device for analyzing size of step in pair of divided mirrors of telescope

    公开(公告)号:US12019231B2

    公开(公告)日:2024-06-25

    申请号:US17418501

    申请日:2019-12-26

    Inventor: Seichi Sato

    CPC classification number: G02B23/06 G01B11/14 G02B5/10 G02B7/183 G02B23/16

    Abstract: Provided is a device for designed for use with a telescope having a primary mirror, such as a reflecting telescope, and to accurately analyzing the size of a step between paired regions of a plurality of mirror segments of the primary mirror. The device designed for use with a telescope whose primary mirror is composed of a plurality of mirror segments, and to analyze the size of a step between paired regions of the plurality of mirror segments comprises: a mask disposed in an optical axis of the primary mirror orthogonally to the optical axis at a given position where a plurality of mirror segment images as respective projected images of the plurality of mirror segments do not overlap each other, wherein a plurality of pairs of primary slits is formed at respective positions in the mirror segment images, wherein each of the primary slits are adjacent to a boundary between the paired regions of the mirror segment images and opposed and parallel to each other with a given spacing therebetween, and wherein at least one reference slit is arranged with respect to each of pairs of the primary slits in the mask, such that it extends at a given angle which is not parallel to each of the pairs of primary slits.

    Optical distance measurement device and machining device

    公开(公告)号:US11977157B2

    公开(公告)日:2024-05-07

    申请号:US17038647

    申请日:2020-09-30

    CPC classification number: G01S17/32 G01B11/14 G01S7/497 G01S7/499

    Abstract: The optical distance measurement device is configured to include an optical interference unit for separating the reflected light into a reflected light of a first polarized wave and a reflected light of a second polarized wave, extracting first and second components orthogonal to each other from an interference light of the reflected light of the first polarized wave and the reference light, and extracting third and fourth components orthogonal to each other from an interference light of the reflected light of the second polarized wave and the reference light, and a polarization rotation unit for acquiring one or more components of horizontal and vertical components of a polarized wave by rotating a polarization angle of a first complex signal having the first and second components and a polarization angle of a second complex signal having the third and fourth components, so that a distance calculation unit calculates, on the basis of the components acquired by the polarization rotation unit, a difference between a frequency of the reflected light and a frequency of the reference light, and calculates a distance to a measurement target from the difference.

    Load Port and Wafer Inspection Method Using the Same

    公开(公告)号:US20240120222A1

    公开(公告)日:2024-04-11

    申请号:US18176570

    申请日:2023-03-01

    Inventor: Tsung-Che Yu

    CPC classification number: H01L21/67265 G01B11/14 G01B11/16

    Abstract: A load port includes a mounting base having: a movable plate; an opening portion mounted to a side of the mounting base through a board and having a driving assembly mounted on the board; and a movable door having a door panel, a lid-picking device and an inspection device mounted on a side surface of the door panel, and a connecting rod. The door panel is connected to the driving assembly and is movable relative to the board. The lid-picking device selectively closes a mounting opening of the board. When the load port carries a front opening unified pod (FOUP), it is able to inspect whether a wafer in the FOUP protrudes, tilts or overlaps with another wafer, and an amount of deformation of the wafer at the same time of opening the movable door, so as to reduce processing steps and improve production efficiency.

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