公开(公告)号：US5476413A

公开(公告)日：1995-12-19

申请号：US306439

申请日：1994-09-19

申请人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda ,  Koichiro Ichikawa ,  Yasuo Inada

发明人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda ,  Koichiro Ichikawa ,  Yasuo Inada

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B21/00 ,  B24D9/06 ,  H01L21/304

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24D9/06

摘要： An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

摘要翻译： 抛光晶片周边部分的装置可以进行研磨速度的改善，并且除了可以更有效地利用砂带工作层的空间使用之外，还包括在其上保持固定磨粒的带; 用于馈送通过缠​​绕自身而存储的带的馈送卷轴; 用于卷绕磁带的卷取卷轴; 其中两个卷盘的两个卷轴被安装成可安装或拆卸的旋转滚筒，其中从进给卷轴到卷取卷轴的带的一部分适于卷绕旋转滚筒 其圆柱形表面紧密接触螺旋形状并且晶片的主面之一被定位成与旋转鼓的中心轴线成一定角度的平面。

公开(公告)号：US06330776B1

公开(公告)日：2001-12-18

申请号：US09517509

申请日：2000-03-02

申请人： Yasuo Jinno ,  Hideto Saito ,  Hideo Tsukagoshi ,  Jun′ichi Iketani ,  Tadao Fujita ,  Minoru Sawaide ,  Yasuo Inada ,  Yoshihiko Shimizu

发明人： Yasuo Jinno ,  Hideto Saito ,  Hideo Tsukagoshi ,  Jun′ichi Iketani ,  Tadao Fujita ,  Minoru Sawaide ,  Yasuo Inada ,  Yoshihiko Shimizu

IPC分类号： E04G2302

CPC分类号： E04H9/02 ,  E04C5/07 ,  E04G23/0218 ,  E04G23/0225 ,  E04G2023/0251 ,  E04G2023/0262

摘要： In the structure for reinforcing a concrete member and the reinforcing method of the present invention, a reinforcing sheet is arranged and joined to a various kinds of concrete member, such as column, beam, wall, floor, and the like, by applying the reinforcing sheet to the surface of the concrete member and attaching to the fixing anchors joined to the concrete member or the other concrete member surrounding the concrete member. The fixing anchor comprises a large amount of reinforcing fiber, and is obtained by bundling a part of the reinforcing fiber. The unbundled portion of the fixing anchor is spread along the surface of the concrete member. The reinforcing sheet is over-lapped to the unbundled portion using resin adhesives. In addition, reinforcing fibers, such as carbon fiber, aramid fiber, glass fiber, and the like are preferably used as the material comprising the fixing anchor and reinforcing sheet. Thereby, the reinforcing member can be joined via the fixing anchor to the concrete members. Therefore, it is possible to securely join the edges of the reinforcing member, and reliably exert the reinforcing effects on the concrete member.

摘要翻译： 在本发明的增强混凝土构件的结构和增强方法中，通过施加加强筋，将各种混凝土构件，例如柱，梁，墙壁，地板等配置并接合在一起， 将其粘贴到混凝土构件的表面并且附接到连接到混凝土构件或围绕混凝土构件的另一混凝土构件的固定锚固件。 固定锚固件包括大量的增强纤维，并且通过将一部分增强纤维捆扎而获得。 固定锚的非捆绑部分沿着混凝土构件的表面扩展。 使用树脂粘合剂将增强片材重叠到未捆绑部分。 此外，优选使用碳纤维，芳族聚酰胺纤维，玻璃纤维等增强纤维作为包含固定锚和增强片的材料。 由此，加强构件能够经由固定锚固件与混凝土构件接合。 因此，可以牢固地接合加强构件的边缘，并且可靠地将增强效果施加在混凝土构件上。

公开(公告)号：US6113463A

公开(公告)日：2000-09-05

申请号：US623771

申请日：1996-03-29

申请人： Fumihiko Hasegawa ,  Yasuyoshi Kuroka ,  Toshihiro Tsuchiya ,  Koichiro Ichikawa ,  Yasuo Inada

发明人： Fumihiko Hasegawa ,  Yasuyoshi Kuroka ,  Toshihiro Tsuchiya ,  Koichiro Ichikawa ,  Yasuo Inada

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B49/02 ,  B24B49/12 ,  B34B49/00 ,  B34B9/02

CPC分类号： B24B49/12 ,  B24B49/02 ,  B24B9/065

摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.

摘要翻译： 公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。 用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。 本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且 根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。

公开(公告)号：US5727990A

公开(公告)日：1998-03-17

申请号：US779040

申请日：1997-01-06

申请人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda ,  Koichiro Ichikawa ,  Yasuo Inada

发明人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda ,  Koichiro Ichikawa ,  Yasuo Inada

IPC分类号： H01L21/304 ,  B24B9/00 ,  B24B9/06 ,  B24B1/00 ,  B24B7/24 ,  B24B9/14

CPC分类号： B24B9/065

摘要： A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

摘要翻译： 公开了一种有效地对半导体晶片的外围倒角部进行镜面研磨的方法和装置。 对晶片的倒角部分的周边侧表面进行镜面抛光，其边缘表面和形成在周边侧表面和每个倾斜表面之间的圆形边缘分别进行。