公开(公告)号：US06896023B2

公开(公告)日：2005-05-24

申请号：US10308423

申请日：2002-12-03

申请人： Masatoshi Murakami ,  Toshihiro Tsuchiya

发明人： Masatoshi Murakami ,  Toshihiro Tsuchiya

IPC分类号： B05C9/14 ,  B05C13/02 ,  B29C65/10 ,  B29C65/48 ,  B63B5/24 ,  B63B9/06 ,  B32B31/26

CPC分类号： B29C65/10 ,  B29C65/4835 ,  B29C66/1122 ,  B29C66/1222 ,  B29C66/1226 ,  B29C66/1312 ,  B29C66/3452 ,  B29C66/54 ,  B29C66/543 ,  B29C66/545 ,  B29C66/80 ,  B29C66/843 ,  B29L2031/307 ,  B63B5/24 ,  B63B9/06 ,  B63B2221/10

摘要： Framework, defining a predetermined curing area, corresponds in size and shape to a provisionally-assembled watercraft body to be subjected to adhesive curing. Openable/closeable gate, constituting one end portion of the framework, allows the provisionally-assembled watercraft body to be carried therethrough into the curing area. Positioning mechanism positions the carried provisionally-assembled watercraft body in the curing area. Warm air blowing mechanism includes a plurality of nozzles provided at predetermined intervals on and along upper horizontal portions of the framework and gate and at a level slightly higher than peripheral edges of a hull and deck of the watercraft body to be joined by adhesive, which blow warm air downward onto the peripheral edges of the watercraft body.

摘要翻译： 限定预定固化区域的框架在尺寸和形状上对应于要经受粘合剂固化的临时组装的船体。 构成框架的一个端部的可开启/关闭的门允许临时组装的船体通过其进入固化区域。 定位机构将装载的临时组装的船体位于定位区域。 暖风吹风机构包括多个喷嘴，其以预定的间隔设置在框架和闸门的上部水平部分上，并且在稍高于要通过粘合剂接合的船体的船体和甲板的周边边缘的水平处， 将暖气向下流到船体的周边。

公开(公告)号：US5711250A

公开(公告)日：1998-01-27

申请号：US561398

申请日：1995-11-21

申请人： Toshihiro Tsuchiya

发明人： Toshihiro Tsuchiya

IPC分类号： A01K63/00 ,  A01K63/06

CPC分类号： A01K63/003 ,  A01K63/006

摘要： A device for raising aquarium fish is a combination of a water tank and a receptacle assembly. The water tank has an upper opening, a lid for closing the upper opening and provided with an illumination mechanism and a filtration mechanism, and a fastening portion. The receptacle assembly is for supplying electricity to the illumination and filtration mechanisms and has a fastened portion for engagement with the fastening portion of the water tank. The receptacle assembly includes an assembly body having an open side facing downward, accommodating a plurality of electric plug recieving receptacles therein and having a receptacle cover disposed inside the assembly body at a position spaced a predetermined distance from the open side of the assembly body for positioning and fixing the plurality of receptacles, and an assembly holder having a lateral wall portion attached to the assembly body and a vertical wall portion extending from the lateral wall portion and parallel to the direction faced by the open side of the assembly body at a distance from the assembly body.

摘要翻译： 用于升高水族鱼的装置是水箱和容器组合体的组合。 水箱具有上开口，用于封闭上开口的盖，并具有照明机构和过滤机构，以及紧固部。 插座组件用于向照明和过滤机构供电，并且具有用于与水箱的紧固部分接合的紧固部分。 插座组件包括具有朝向下方的开口侧的组装体，在其中容纳多个电插头接收插座，并且具有插座盖，该插座盖设置在与组件本体的开口侧隔开预定距离的位置处，用于定位 并且固定所述多个插座，以及具有附接到所述组件主体的侧壁部分的组件保持器和从所述侧壁部分延伸并平行于所述组件主体的敞开侧面的方向的垂直壁部分， 组装体。

公开(公告)号：US20060068681A1

公开(公告)日：2006-03-30

申请号：US10523976

申请日：2003-07-30

申请人： Toshihiro Tsuchiya

发明人： Toshihiro Tsuchiya

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B37/042 ,  B24B37/345 ,  H01L21/02024 ,  H01L21/76254

摘要： The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus which comprises a rotatable table having a polishing cloth adhered thereon and a polishing head equipped with a wafer holding plate opposing to the table and in which the back surface of the wafer is held by a holding surface of the wafer holding plate and the front surface of the wafer is pressed to and polished by the polishing pad, comprising a polishing step of polishing the front surface of the wafer to a predetermined total polishing stock removal without changing the polishing apparatus, wherein the polishing step is divided into plural sub-steps and a holding position of the wafer in a subsequent sub-step is different from a holding position of the wafer in a previous sub-step.

摘要翻译： 本发明提供一种晶片抛光方法和抛光装置，其能够防止由于抛光造成的晶片的周边凹陷，然后制造晶片，特别是高平坦度的SOI晶片。 提供了一种使用抛光装置的晶片抛光方法，该抛光装置包括具有粘附在其上的抛光布的可旋转工作台和配备有与工作台相对的晶片保持板的抛光头，其中晶片的后表面由保持 晶片保持板的表面和晶片的前表面被抛光垫压制和抛光，包括抛光步骤，其将晶片的前表面抛光至预定的总抛光材料去除而不改变抛光装置，其中 抛光步骤被分成多个子步骤，并且随后的子步骤中的晶片的保持位置不同于之前的子步骤中的晶片的保持位置。

公开(公告)号：US06390284B1

公开(公告)日：2002-05-21

申请号：US09573055

申请日：2000-05-18

申请人： Toshio Yamada ,  Toshihiro Tsuchiya ,  Norihisa Ohgi

发明人： Toshio Yamada ,  Toshihiro Tsuchiya ,  Norihisa Ohgi

IPC分类号： B65G1732

CPC分类号： B62D65/18

摘要： A hanging-down jig is provided for supporting a vehicle body frame for a motorcycle in a hung-down manner on a hanger of an overhead conveyor. A dummy frame is mounted on the vehicle body frame for the motorcycle for supporting the vehicle body frame in a hang-down manner on a support arm of the hanger of the overhead conveyor. The dummy frame includes a center member coupled to the vehicle body frame by a pin, and a pair of left and right side members coupled to the vehicle body frame by a pin. The angle of, the longitudinal positions of and the lateral distance between the side members with respect to the center member can be adjusted as desired. The longitudinal and vertical positions of a support portion provided on the support arm of the hanger and engaged with a hanging-down member of the dummy frame can be adjusted as desired.

摘要翻译： 提供一种悬挂式夹具，用于以悬挂方式将机动车辆的车体框架支撑在架空输送机的悬挂架上。 一个虚拟框架安装在用于摩托车的车身框架上，用于将悬架式车体框架以悬挂方式支撑在架空输送机的吊架的支撑臂上。 虚拟框架包括通过销连接到车身框架的中心构件，以及通过销联接到车身框架的一对左侧和右侧构件。 可以根据需要调整侧构件相对于中心构件的纵向位置和横向距离的角度。 可以根据需要调节设置在衣架的支撑臂上并与虚拟框架的下垂构件接合的支撑部分的纵向和垂直位置。

公开(公告)号：US5928066A

公开(公告)日：1999-07-27

申请号：US993989

申请日：1997-12-18

申请人： Fumihiko Hasegawa ,  Yasuyoshi Kuroda ,  Toshihiro Tsuchiya ,  Koichiro Ichikawa ,  Yasuo Inada

发明人： Fumihiko Hasegawa ,  Yasuyoshi Kuroda ,  Toshihiro Tsuchiya ,  Koichiro Ichikawa ,  Yasuo Inada

IPC分类号： B24B9/06 ,  B24D9/06 ,  B24B5/00

CPC分类号： B24D9/06 ,  B24B9/065

摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

摘要翻译： 公开了半导体晶片的外围倒角部分的抛光装置。 抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件 所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。

公开(公告)号：USD361166S

公开(公告)日：1995-08-08

申请号：US16205

申请日：1993-12-10

申请人： Toshihiro Tsuchiya

设计人： Toshihiro Tsuchiya

公开(公告)号：US5232298A

公开(公告)日：1993-08-03

申请号：US970233

申请日：1992-10-30

申请人： Tomoharu Mitsunari ,  Toshihiro Tsuchiya

发明人： Tomoharu Mitsunari ,  Toshihiro Tsuchiya

IPC分类号： A47L13/30

CPC分类号： A47L13/30

摘要： The present invention relates to an applicator for applying a liquid such as floor wax. When an operator adjusts a handle-mounted valve, drops of wax fall down from tube-shaped nozzles arranged in an equidistant relationship on the base of the applicator. The wax is supplied from a bag-shaped container mounted on an intermediate portion of the handle and flows down to the nozzles via filters, an adjusting valve, a distributing chamber and discharge passages. When the applicator is not in use, it is placed on a tray which keeps the base moist with a cloth tightly stretched on the base of the applicator. Steam fills the space between the cloth and the base to prevent solidification of the wax.

摘要翻译： 本发明涉及一种用于施加诸如地板蜡的液体的施加器。 当操作者调节手柄安装的阀时，蜡滴从涂敷器底部等距离关系的管状喷嘴落下。 蜡从安装在手柄的中间部分的袋形容器供给，并通过过滤器，调节阀，分配室和排出通道向下流动到喷嘴。 当施用器不使用时，将其放置在托盘上，该托盘使基部湿润，布被紧紧地拉伸在施用器的基部上。 蒸汽填充布和基部之间的空间以防止蜡的固化。

公开(公告)号：US5056181A

公开(公告)日：1991-10-15

申请号：US412141

申请日：1989-09-25

申请人： Toshihiro Tsuchiya ,  Tomoharu Mitsunari ,  Mitsuaki Noguchi

发明人： Toshihiro Tsuchiya ,  Tomoharu Mitsunari ,  Mitsuaki Noguchi

IPC分类号： A46B7/10 ,  A46D1/00 ,  A47L9/04

CPC分类号： A47L9/0477 ,  A46B7/10 ,  A46D1/00 ,  Y10T428/31707 ,  Y10T428/3171 ,  Y10T428/3175

摘要： In a rotary brush wherein the surface of a rotating basic shaft has mounted thereto at least one flexible blade, the surface of the blade made of rubber or a thermoplastic elastomer as its base material and which stands face to face with a surface to be cleaned is covered with a plastic material having wear resistance and slipperiness.

摘要翻译： 在其中旋转的基本轴的表面安装有至少一个柔性叶片的旋转刷中，由橡胶或热塑性弹性体制成的叶片的表面作为基底材料并且与要被清洁的表面面对， 覆盖着具有耐磨性和滑溜性的塑料材料。

公开(公告)号：US4646380A

公开(公告)日：1987-03-03

申请号：US757516

申请日：1985-07-19

申请人： Kiyoshi Kobayashi ,  Toshihiro Tsuchiya

发明人： Kiyoshi Kobayashi ,  Toshihiro Tsuchiya

IPC分类号： A47L11/22 ,  A47L11/33

CPC分类号： A47L11/4069 ,  A47L11/33 ,  A47L11/4041

摘要： A rotary cleaning member comprises a revolving shaft installed rotatably inside a main body casing, and a plurality of flexible blades provided with a number of projections on the surface thereof abutting upon the surface of a floor, these blades extending radially from the circumference of the revolving shaft one another in a cleaner wherein the rotary cleaning member installed in the main body casing is rotated to spring up dust or the like on the floor, or convey the dust or the like sprung up by means of said rotary cleaning member to a prescribed position for receiving the dust or the like in combination with suction.

摘要翻译： 旋转清洁构件包括可旋转地安装在主体壳体内的旋转轴和多个柔性叶片，其在其表面上设置有多个突起，所述多个突起抵靠在地板的表面上，这些叶片从旋转的圆周的周边径向延伸 在清洁器中彼此相对地设置，其中安装在主体外壳中的旋转清洁构件旋转以在地板上弹出灰尘等，或将通过所述旋转清洁构件弹起的灰尘等传送到规定位置 用于接收与抽吸结合的灰尘等。

公开(公告)号：US5733177A

公开(公告)日：1998-03-31

申请号：US688174

申请日：1996-07-29

申请人： Toshihiro Tsuchiya ,  Kouichi Tanaka ,  Kiromasa Hashimoto ,  Kouji Morita ,  Tsutomu Takaku

发明人： Toshihiro Tsuchiya ,  Kouichi Tanaka ,  Kiromasa Hashimoto ,  Kouji Morita ,  Tsutomu Takaku

IPC分类号： B24B1/00 ,  B24B37/005 ,  B24B37/10 ,  H01L21/304 ,  B24B7/04

CPC分类号： B24B37/042

摘要： The invention concerns a process of polishing wafers, in which a silicon wafer held on a wafer support plate rotatable under a predetermined applied pressure, is polished by mechanochemical polishing in a plurality of polishing steps with an abrasive material interposed between the wafer and a polishing pad cloth applied to a polishing surface plate moved relative to the wafer support plate at a predetermined relative speed. Quality comparable to that of wafers obtainable by a prior art three-step polishing process can be obtained with a two-step wafer polishing step comprising a primary polishing step and a final polishing step. The primary polishing step is performed by setting a high polishing pressure of 300 to 700 g/cm.sup.2 and a reference relative speed of 50 to 150 m/min., and quick increase of the relative speed to 2 to 4 times and quick reduction of the polishing pressure down to 1/2 to 1/10 are caused in a final stage of the primary polishing step. The final polishing step is performed by setting a reference polishing pressure of 100 to 400 g/cm.sup.2 and a reference relative speed of 50 to 150 m/min., and in its final stage the relative speed is quickly reduced to 1/2 to 1/5.

摘要翻译： 本发明涉及抛光晶片的方法，其中保持在可预定施加压力下旋转的晶片支撑板上的硅晶片通过在多个抛光步骤中的机械化学抛光进行研磨，其中研磨材料插入在晶片和抛光垫之间 施加到以预定相对速度相对于晶片支撑板移动的抛光表面板的布。 通过现有技术的三步抛光工艺可获得的晶片的质量可以通过包括初级抛光步骤和最终抛光步骤的两步晶片抛光步骤获得。 通过设定300〜700g / cm 2的高研磨压力和50〜150m /分钟的基准相对速度，进行一次抛光工序，将相对速度快速提高至2〜4倍，快速降低 在主抛光步骤的最后阶段引起抛光压力降至+ E，fra 1/2 + EE至+ E，fra 1/10 + EE。 通过设定100〜400g / cm 2的基准研磨压力和50〜150m /分钟的基准相对速度来进行最终的研磨工序，在最终阶段将相对速度迅速降低至+ E， / 2 + EE至+ E，fra 1/5 + EE。