公开(公告)号：US10375338B2

公开(公告)日：2019-08-06

申请号：US15421881

申请日：2017-02-01

Applicant: OmniVision Technologies, Inc.

Inventor： Zheng Yang ,  Hiroaki Ebihara ,  Chun-Ming Tang ,  Chao-Fang Tsai ,  Rui Wang ,  Tiejun Dai

IPC: H04N5/378 ,  H04N5/369 ,  H04N5/374 ,  H01L27/146 ,  H04N5/3745

Abstract: A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit having a bond contact coupled to the bond contact of a macrocell of the photodiode die. Each macrocell unit lies within a supercell and has a reset transistor adapted to reset photodiodes of the macrocell of the photodiode die. Each supercell has at least one common source amplifier adapted to receive signal from the bond contact of a selected macrocell unit of the supercell, the common source amplifier coupled to drive a column line through a selectable source follower. In embodiments, the common source amplifiers of several supercells drive the selectable source follower through a distributed differential amplifier.