公开(公告)号：US20210356821A1

公开(公告)日：2021-11-18

申请号：US16875953

申请日：2020-05-15

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng FAN ,  Wei-Feng LIN

IPC: G02F1/1362

Abstract: An active-pixel device assembly with stray-light reduction includes an active-pixel device including a semiconductor substrate and an array of active pixels, a light-transmissive substrate disposed on a light-receiving side of the active-pixel device, and a rough opaque coating disposed on a first surface of the light-transmissive substrate and forming an aperture aligned with the array of active pixels, wherein the rough opaque coating is rough so as to suppress reflection of light incident thereon from at least one side. A method for manufacturing a stray-light-reducing coating for an active-pixel device assembly includes depositing an opaque coating on a light-transmissive substrate such that the opaque coating forms a light-transmissive aperture, and roughening the opaque coating to form a rough opaque coating, said roughening including treating the opaque coating with an alkaline solution.

公开(公告)号：US20200227394A1

公开(公告)日：2020-07-16

申请号：US16248125

申请日：2019-01-15

Applicant: Omnivision Technologies, Inc.

Inventor： Chien Chan YEH ,  Ying-Chih KUO ,  Wei-Feng LIN

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor device package includes a transparent substrate, a photo detector and a first conductive layer. The transparent substrate has a first surface and a first cavity underneath the first surface. The photo detector is disposed within the first cavity. The photo detector has a sensing area facing toward a bottom surface of the first cavity of the transparent substrate. The first conductive layer is disposed over the transparent substrate and electrically connected to the photo detector.