公开(公告)号：US20200322507A1

公开(公告)日：2020-10-08

申请号：US16377391

申请日：2019-04-08

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Jau-Jan DENG ,  Chia-Yang CHANG ,  Wei-Feng LIN

IPC: H04N5/225 ,  G02B27/09 ,  H04N5/232 ,  H01L27/146

Abstract: A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.

公开(公告)号：US20200098806A1

公开(公告)日：2020-03-26

申请号：US16139019

申请日：2018-09-22

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng LIN ,  Chun-Sheng FAN

IPC: H01L27/146

Abstract: An image-sensor package includes a cover glass, an image sensor, and an integrated circuit. The cover glass has a cover-glass bottom surface, to which the image sensor is bonded. The integrated circuit is beneath the cover-glass bottom surface, adjacent to the image sensor, and electronically connected to the image sensor. A method for packaging an image sensor includes attaching an image sensor to a cover-glass bottom surface of a cover glass, a light-sensing region of the image sensor facing the cover-glass bottom surface. The method also includes attaching an integrated circuit to the cover-glass bottom surface, a top IC-surface of the integrated circuit facing the cover-glass bottom surface.

公开(公告)号：US20230262310A1

公开(公告)日：2023-08-17

申请号：US17674675

申请日：2022-02-17

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng CHEN ,  Wei-Ping CHEN ,  Jau-Jan DENG ,  Wei-Feng LIN

IPC: H04N5/225

CPC classification number: H04N5/2256 ,  H04N5/2257 ,  H04N5/2254

Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.

公开(公告)号：US20230118866A1

公开(公告)日：2023-04-20

申请号：US17747803

申请日：2022-05-18

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng CHEN ,  Wei-Ping CHEN ,  Wei-Feng LIN ,  Jau-Jan DENG

IPC: A61B1/05 ,  A61B1/06 ,  A61B1/00

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

公开(公告)号：US20240355846A1

公开(公告)日：2024-10-24

申请号：US18752633

申请日：2024-06-24

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng FAN ,  Wei-Feng LIN

IPC: H01L27/146 ,  H04N23/54

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H04N23/54

Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.

公开(公告)号：US20200052019A1

公开(公告)日：2020-02-13

申请号：US16100835

申请日：2018-08-10

Applicant: OmniVision Technologies, Inc.

Inventor： Chien-Chan YEH ,  Ying-Chih KUO ,  Wei-Feng LIN ,  Chun-Sheng FAN

IPC: H01L27/146

Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.

公开(公告)号：US20230136491A1

公开(公告)日：2023-05-04

申请号：US17517396

申请日：2021-11-02

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng FAN ,  Wei-Feng LIN

IPC: H01L27/146 ,  H04N5/225

Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.

公开(公告)号：US20210052134A1

公开(公告)日：2021-02-25

申请号：US16548753

申请日：2019-08-22

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng CHEN ,  Chien-Chan YEH ,  Cheng-Fang CHIU ,  Wei-Feng LIN

IPC: A61B1/005

Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region. The connection region further includes an electrically-insulating second top rigid-layer and a plurality of connector bond-pads each exposed on a top surface of the second top rigid-layer facing away from the top substrate-surface in the connection region, and electrically connected to a respective device bond-pad via at least one of the electrically conductive layers.

公开(公告)号：US20180294298A1

公开(公告)日：2018-10-11

申请号：US15480131

申请日：2017-04-05

Applicant: OmniVision Technologies, Inc.

Inventor： Chen-Wei TSAI ,  Chun-Sheng FAN ,  Wei-Feng LIN

IPC: H01L27/146 ,  H04N5/369

CPC classification number: H01L27/14618 ,  H01L27/14603 ,  H01L27/14605 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1465 ,  H01L27/14683 ,  H01L27/14687 ,  H04N5/369

Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.

公开(公告)号：US20230122722A1

公开(公告)日：2023-04-20

申请号：US17504105

申请日：2021-10-18

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng CHEN ,  Wei-Ping CHEN ,  Jau-Jan DENG ,  Wei-Feng LIN ,  Chun-Sheng FAN

IPC: A61B1/05 ,  A61B1/06 ,  A61B1/00

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.