公开(公告)号：US11467046B2

公开(公告)日：2022-10-11

申请号：US16527582

申请日：2019-07-31

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yousuke Irie ,  Hirotsugu Inoue ,  Takuya Niioka

IPC: G01L1/10 ,  H01J37/22 ,  H01J37/26 ,  G01L1/24 ,  G01N3/08 ,  G01N3/32 ,  G01N3/06

Abstract: In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.

公开(公告)号：US10830652B2

公开(公告)日：2020-11-10

申请号：US16215691

申请日：2018-12-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yousuke Irie

IPC: G01L1/24 ,  G01K3/10 ,  G01J5/00 ,  H04N5/33 ,  H04N7/18 ,  G01B11/16 ,  G01L1/00 ,  G01M5/00 ,  G01N25/20 ,  G01N25/72 ,  G01M99/00 ,  G01M11/08

Abstract: A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.