公开(公告)号：US11330584B2

公开(公告)日：2022-05-10

申请号：US16907789

申请日：2020-06-22

Applicant: QUALCOMM Incorporated

Inventor： Xiaoyin He ,  Peter Pui Lok Ang ,  Krishna Kiran Mukkavilli ,  Joseph Patrick Burke

IPC: H04W72/04 ,  H04L5/00 ,  H04W72/08 ,  H04L7/033 ,  H04J11/00 ,  H04W72/00

Abstract: Certain aspects of the present disclosure relate to methods and apparatus for interference management with adaptive resource block (RB) allocation. In an exemplary method, a base station (BS) obtains an indication that downlink transmissions to a first user equipment (UE) potentially interfere with uplink transmissions by a second UE, the BS dynamically allocates, based on the indication, a first set of one or more resource blocks (RBs) for the downlink transmissions to the first UE, and the BS then transmits an indication of the first set of RBs to the first UE. Other aspects, embodiments, and features are also claimed and described.

公开(公告)号：US20200336159A1

公开(公告)日：2020-10-22

申请号：US16922811

申请日：2020-07-07

Applicant: QUALCOMM Incorporated

Inventor： Haim Mendel Weissman ,  Raviv Lior ,  Xiaoyin He ,  Vladimir Aparin

IPC: H04B1/00 ,  H04W72/04 ,  H04B1/40 ,  H04B7/06

Abstract: Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.