公开(公告)号：US09753874B2

公开(公告)日：2017-09-05

申请号：US14627318

申请日：2015-02-20

Applicant: QUALCOMM Incorporated

Inventor： Adam Edward Newham ,  Rashid Ahmed Akbar Attar ,  Seung Hyuk Kang ,  Jung Pill Kim ,  Sungryul Kim ,  Taehyun Kim

IPC: G06F13/28 ,  G06F12/02 ,  G06F9/44

CPC classification number: G06F13/28 ,  G06F9/4406 ,  G06F12/0246 ,  G06F2212/7209

Abstract: Multi-step programming of heat-sensitive non-volatile memory (NVM) in processor-based systems, and related methods and systems are disclosed. To avoid relying on programmed instructions stored in heat-sensitive NVM during fabrication, wherein the programmed instructions can become corrupted during thermal packaging processes, the NVM is programmed in a multi-step programming process. In a first programming step, a boot loader comprising programming instructions is loaded into the NVM. The boot loader may be loaded into the NVM after the thermal processes during packaging are completed to avoid risking data corruption in the boot loader. Thereafter, the programmed image can be loaded quickly into a NV program memory over the peripheral interface using the boot loader to save programming time and associated costs, as opposed to loading the programmed image using lower transfer rate programming techniques. The processor can execute the program instructions to carry out tasks in the processor-based system.

公开(公告)号：US20160246608A1

公开(公告)日：2016-08-25

申请号：US14627318

申请日：2015-02-20

Applicant: QUALCOMM Incorporated

Inventor： Adam Edward Newham ,  Rashid Ahmed Akbar Attar ,  Seung Hyuk Kang ,  Jung Pill Kim ,  Sungryul Kim ,  Taehyun Kim

IPC: G06F9/44 ,  G06F13/28 ,  G06F12/02

CPC classification number: G06F13/28 ,  G06F9/4406 ,  G06F12/0246 ,  G06F2212/7209

Abstract: Multi-step programming of heat-sensitive non-volatile memory (NVM) in processor-based systems, and related methods and systems are disclosed. To avoid relying on programmed instructions stored in heat-sensitive NVM during fabrication, wherein the programmed instructions can become corrupted during thermal packaging processes, the NVM is programmed in a multi-step programming process. In a first programming step, a boot loader comprising programming instructions is loaded into the NVM. The boot loader may be loaded into the NVM after the thermal processes during packaging are completed to avoid risking data corruption in the boot loader. Thereafter, the programmed image can be loaded quickly into a NV program memory over the peripheral interface using the boot loader to save programming time and associated costs, as opposed to loading the programmed image using lower transfer rate programming techniques. The processor can execute the program instructions to carry out tasks in the processor-based system.

Abstract translation: 公开了基于处理器的系统中的热敏非易失性存储器（NVM）的多步编程以及相关的方法和系统。 为了避免在制造期间依赖于存储在热敏NVM中的编程指令，其中编程指令可能在热封装过程中被破坏，NVM以多步编程过程编程。 在第一编程步骤中，包括编程指令的引导加载器被加载到NVM中。 引导加载程序可能在打包完成后的热处理后加载到NVM中，以避免引导加载程序中的数据损坏风险。 此后，与使用较低传输速率编程技术加载编程图像相比，编程图像可以使用引导加载程序通过外设接口快速加载到NV程序存储器中，从而节省编程时间和相关成本。 处理器可以执行程序指令以在基于处理器的系统中执行任务。