公开(公告)号：US09945818B2

公开(公告)日：2018-04-17

申请号：US14628211

申请日：2015-02-20

申请人： QUALCOMM Incorporated

发明人： Suryaprakash Ganti ,  Srikanth Chilukuru ,  Livingstone Song ,  Kostadin Dimitrov Djordjev ,  Jack Conway Kitchens ,  John Schneider ,  Nicholas Ian Buchan ,  Leonard Eugene Fennell ,  Hrishikesh Vijaykumar Panchawagh ,  Ashish Hinger ,  Nai-Kuei Kuo ,  Kollengode Narayanan ,  Samir Kumar Gupta ,  Timothy Dickinson ,  Max Hamel ,  David William Burns ,  Muhammed Ibrahim Sezan ,  Eugene Dantsker

IPC分类号： G01N29/09 ,  G06K9/00

CPC分类号： G01N29/09 ,  G01N2291/018 ,  G06K9/0002

摘要： Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.

公开(公告)号：US20150241393A1

公开(公告)日：2015-08-27

申请号：US14628211

申请日：2015-02-20

申请人： QUALCOMM Incorporated

发明人： Suryaprakash Ganti ,  Srikanth Chilukuru ,  Livingstone Song ,  Kostadin Dimitrov Djordjev ,  Jack Conway Kitchens ,  John Schneider ,  Nicholas Ian Buchan ,  Leonard Eugene Fennell ,  Hrishikesh Vijaykumar Panchawagh ,  Ashish Hinger ,  Nai-Kuei Kuo ,  Kollengode Narayanan ,  Samir Kumar Gupta ,  Timothy Dickinson ,  Max Hamel ,  David William Burns ,  Muhammed Ibrahim Sezan ,  Eugene Dantsker

IPC分类号： G01N29/09

CPC分类号： G01N29/09 ,  G01N2291/018 ,  G06K9/0002

摘要： Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.

摘要翻译： 公开了超声波按钮的实施例和使用超声波按钮的方法。 在一个实施例中，超声波按钮可以包括被配置为传送超声波的超声波发射器，被配置为接收超声波的反射波的压电接收器层，被配置为保护超声波发射器和压电接收器层的压板层， 第一匹配层，其被配置为将压板层的声阻抗与手指的脊的声阻抗匹配;以及超声波传感器阵列，被配置为使用反射波来检测手指。

公开(公告)号：US20150198699A1

公开(公告)日：2015-07-16

申请号：US14589783

申请日：2015-01-05

申请人： QUALCOMM Incorporated

发明人： Nai-Kuei Kuo ,  Kostadin Dimitrov Djordjev ,  Ranjith Ranganathan ,  Nao Sugawara Chuei

IPC分类号： G01S7/52 ,  G01S15/02

CPC分类号： G01S7/52017 ,  G01S15/02 ,  G06K9/0002

摘要： Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.

摘要翻译： 技术描述了通过在传感器堆叠中包含声腔来产生更大输出信号和提高超声波传感器的图像质量的结构和方法。 在一些实施例中，超声波传感器单元可以在制造期间或在供应阶段期间被调整以使用不同的厚度和材料。 在一些实施例中，可以使用超声波传感器单元中的声腔来产生驻波信号，用于捕获放置在传感器表面上的物体的超声波图像。 在一些实施方案中，超声波传感器可以包括位于发射器和接收器之间的超声波发射器，压电接收器，薄膜晶体管（TFT）层和TFT衬底，一个或多个粘合剂层以及任选的覆盖材料和涂层。 可以使用传感器材料和相关联的粘合剂附着层的厚度，密度和声速来获得所需的声腔并提高性能。