摘要:
An integrated circuit (IC) includes a semiconductor substrate and a mold compound on the semiconductor substrate. The IC also includes an acoustic signal generator between the mold compound and the semiconductor substrate. The acoustic signal generator is configured to transmit an acoustic signal having a predetermined set of frequencies through at least one of the semiconductor substrate or the mold compound.
摘要:
Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.
摘要:
An integrated system and method to acquire the health state of a structure identifying the presence of damage, and to self-repair the damage in the considered structure. A sensor network installed in the structure is interrogated by a dedicated hardware for damage detection. In case of damage is detected by the sensor network in the structure, the sensor network is triggered and generates harmonic excitation in the structure. Due to the excitation, the natural frequency of vascular microtubes and/or capsules presented in the structure is reached, promoting their disruption. The vascular microtubes and/or capsules disruption along the damage releases the healing compound, repairing the damaged portion of the structure.
摘要:
Disclosed are a device and a method for testing impedance characteristic and expansion performance of a sound absorption material. The device includes a first cavity and a second cavity which are both sealed. The first cavity is communicated with the second cavity through a slit channel. The second cavity is used for placing a sound absorption material therein. The device further includes a sound excitation source whose sounding face is located in the first cavity and used to provide a testing sound pressure. The device further includes two sound pickup sensors whose sound pickup surfaces are respectively arranged in the first cavity and the second cavity and respectively used to detect sound pressure in the first cavity and the second cavity. The device further includes a material for enclosing the first cavity and the second cavity is a hard sound insulation material.
摘要:
This application relates to methods and apparatus for fiber optic sensing which can provide information about the environment in which the fiber optic is deployed. In particular the application relates to fiber optic based sensing of the mechanical impedance of the environment. The method comprises using an interrogator (201) to interrogate an optical fiber (104) which is coupled to a first element (202; 802) which is responsive to electromagnetic fields. In use a varying electric current (I), which may be an alternating current, is applied so as to induce a varying force (F) on said first element. The optical radiation backscattered from within the optical fiber is analyzed to determine a measurement signal indicative of a variation in the backscattered radiation corresponding with said electric current applied. The first element may be a first conductor (202) and the varying current may be supplied to the first conductor, or to a second conductor (701). Alternatively the first element could be a magnetic element (802). By applying a variable force to the first element, and hence the optical fiber, the characteristics of the environment can be determined.
摘要:
A method of using a dual-port measurement system to measure acoustic impedance is used to measure an acoustic impedance Z of a tested object. The tested object includes an input end and an output end opposite to the input end. The dual-port measurement system comprises a first impedance tube and a second impedance tube. The first impedance tube includes a first inlet where a plane wave of a sound source is input, and a first outlet connected with the input end. The second impedance tube includes a second inlet connected with the output end, and a second outlet where the plane wave is output. The method uses the dual-port measurement system and a two-boundary method to obtain the acoustic impedances Z, whereby the dual-port measurement system is conveniently applied to various fields, such as the design of earphones, muffler tubes, sound absorption materials, and artificial ears.
摘要:
A workpiece clamping status detection system and method for detecting a clamping state of a clamping device is provided. A clamping device having a clamping surface is configured to selectively clamp a workpiece to the clamping surface. The clamping device may be an electrostatic chuck or a mechanical clamp for selectively securing a semiconductor wafer thereto. A vibration-inducing mechanism is further provided, wherein the vibration-inducing mechanism is configured to selectively vibrate one or more of the clamping device and workpiece. A vibration-sensing mechanism is also provided, wherein the vibration-sensing mechanism is configured to detect the vibration of the one or more of the clamping device and workpiece. Detection of clamping status utilizes changes in acoustic properties, such as a shift of natural resonance frequency or acoustic impedance, to determine clamping condition of the workpiece. A controller is further configured to determine a clamping state associated with the clamping of the workpiece to the clamping surface, wherein the clamping state is associated with the detected vibration of the one or more of the clamping device and workpiece.
摘要:
The present invention is seen to provide a new methodology, testing system designs and concept to enable in situ real time monitoring of the cure process. Apparatus, system, and method for the non-destructive, in situ monitoring of the time dependent curing of advanced materials using one or more differential ultrasonic waveguide cure monitoring probes. A differential ultrasonic waveguide cure monitoring probe in direct contact with the material to be cured and providing in situ monitoring of the cure process to enable assessment of the degree of cure or cure level in a non-cure related signal variances (e.g., temperature) independent calibrated response manner. A differential ultrasonic waveguide cure monitoring probe including a transducer coupled to a waveguide and incorporating correction and calibration methodology to accurately and reproducibly monitor the cure process and enable assessment of cure level via ultrasonic reflection measurements. The amplitude of the corrected interface response signal reflected from the probe-resin interface indicating changes in the modulus of the material during the cure.
摘要:
Siemens reactors for polysilicon deposition may employ faster and/or more economical deposition conditions without reduction in yield, by pre-sorting polysilicon rods into different quality classifications prior to comminution, and further sorting the polysilicon fragments in each classification into further classifications.
摘要:
Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.