COLD PLATE FOR COOLING ELECTRONIC COMPONENT
    11.
    发明公开

    公开(公告)号:US20230345672A1

    公开(公告)日:2023-10-26

    申请号:US17825433

    申请日:2022-05-26

    CPC classification number: H05K7/20336 H05K7/20509

    Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

    NUCLEATION SURFACE TREATMENT FOR THERMAL COOLING

    公开(公告)号:US20230345671A1

    公开(公告)日:2023-10-26

    申请号:US17851365

    申请日:2022-06-28

    CPC classification number: H05K7/20318 H05K7/2039

    Abstract: A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

    SYSTEMS AND METHODS FOR VAPOR-COMPRESSED COOLING

    公开(公告)号:US20230262934A1

    公开(公告)日:2023-08-17

    申请号:US17725053

    申请日:2022-04-20

    CPC classification number: H05K7/20354 H05K7/20318 H05K7/20309 H05K7/20381

    Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

    THERMAL WAKE SUPPRESSOR
    14.
    发明公开

    公开(公告)号:US20230213987A1

    公开(公告)日:2023-07-06

    申请号:US17647042

    申请日:2022-01-05

    CPC classification number: G06F1/20

    Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

    Anti-Leakage Liquid Cooling Connectors

    公开(公告)号:US20220159874A1

    公开(公告)日:2022-05-19

    申请号:US17204528

    申请日:2021-03-17

    Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

    RACK FOR IMMERSION COOLING
    16.
    发明申请

    公开(公告)号:US20220110222A1

    公开(公告)日:2022-04-07

    申请号:US17165597

    申请日:2021-02-02

    Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

    STREAMLINED AIR BAFFLE FOR ELECTRONIC DEVICE
    17.
    发明申请

    公开(公告)号:US20190116689A1

    公开(公告)日:2019-04-18

    申请号:US15895345

    申请日:2018-02-13

    Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.

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