公开(公告)号：US20190096568A1

公开(公告)日：2019-03-28

申请号：US16054269

申请日：2018-08-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Sook YOON ,  Sang Ho SHIN ,  Byung Kug CHO ,  Sung Jin PARK ,  Jae Wook LEE

IPC: H01F27/29 ,  H01F17/04 ,  H01F17/00 ,  H01F27/28 ,  H01F27/30

Abstract: An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.

公开(公告)号：US20230137018A1

公开(公告)日：2023-05-04

申请号：US17969178

申请日：2022-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Wook LEE ,  In Young KANG ,  Sung Kwon OH

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/02 ,  H01F27/29 ,  H01F1/20

Abstract: A coil component includes a body including magnetic powder particles and an insulating resin, a coil portion disposed in the body and including a lead-out portion exposed to one surface of the body, and an external electrode disposed on one surface of the body. The external electrode includes an intermetallic compound (IMC) disposed on the lead-out portion exposed to one surface of the body and having an average thickness of 1 μm or more, and a first electrode layer including a base resin, and a conductive connection portion disposed in the base resin and in contact with the intermetallic compound.

公开(公告)号：US20210202148A1

公开(公告)日：2021-07-01

申请号：US16911623

申请日：2020-06-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwi Jong LEE ,  Jung Min KIM ,  Sung Jin HUH ,  Jin Hyuck YANG ,  Jae Wook LEE ,  Ji Hyun EOM

IPC: H01F17/00 ,  H01F17/04 ,  H01F27/32 ,  H01F27/28

Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.