中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.014 seconds)

    ELECTRONIC COMPONENT
    1.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190096568A1

    公开(公告)日：2019-03-28

    申请号：US16054269

    申请日：2018-08-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ji Sook YOON ,  Sang Ho SHIN ,  Byung Kug CHO ,  Sung Jin PARK ,  Jae Wook LEE

    IPC: H01F27/29 ,  H01F17/04 ,  H01F17/00 ,  H01F27/28 ,  H01F27/30

    Abstract: An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.

    MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    4.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    多层电子元件和板

    公开(公告)号：US20150371755A1

    公开(公告)日：2015-12-24

    申请号：US14504107

    申请日：2014-10-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jeong Hwan IM ,  So Young JUN ,  Hyun Ju JUNG ,  Sung Jin PARK ,  Young Jin HA

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/002 ,  H01F2027/2809

    Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.

    Abstract translation: 多层电子部件可以包括：多层体，包括多个绝缘层; 通过将布置在所述多个绝缘层上的各个导电图案彼此电连接而提供的内部线圈部分; 以及设置在多层体的两端面上的第一外部电极和第二外部电极。 设置在多层体的周边区域中的至少一个导电图案的周边可以小于布置在多层体的中心区域中的导电图案的周边。

    CERAMIC ELECTRONIC COMPONENT
    5.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 审中-公开
    陶瓷电子元件

    公开(公告)号：US20150187487A1

    公开(公告)日：2015-07-02

    申请号：US14478792

    申请日：2014-09-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Jin PARK ,  Hyeog Soo SHIN

    IPC: H01F27/29 ,  H01F27/28

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292

    Abstract: A ceramic electronic component may include: a chip body; external electrode forming portions formed on both ends of the chip body in a length direction, on at least one of an upper surface and a lower surface of the chip body, respectively; external electrodes formed on the external electrode forming portions, respectively; and a protective layer formed between the external electrode forming portions and having a thickness greater than that of the external electrodes.

    Abstract translation: 陶瓷电子部件可以包括：芯片体; 分别在芯体的上表面和下表面中的至少一个上沿长度方向形成在芯体的两端的外部电极形成部; 外部电极分别形成在外部电极形成部分上; 以及形成在外部电极形成部之间并且具有比外部电极的厚度大的厚度的保护层。

    FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME
    6.
    发明申请
    FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME 有权
    过滤芯片元件及其制备方法

    公开(公告)号：US20140132366A1

    公开(公告)日：2014-05-15

    申请号：US14078317

    申请日：2013-11-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Suk KIM ,  Sung Kwon WI ,  Hyeog Soo SHIN ,  Sang Moon LEE ,  Young Seuck YOO ,  Sung Jin PARK

    IPC: H03H7/01

    CPC classification number: H03H7/0138 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007

    Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

    Abstract translation: 本发明公开了一种过滤芯片元件，包括铁氧体衬底，形成在铁氧体衬底上的内部线圈图案; 以及填充在形成在铁氧体基板上的内部线圈图案之间的铁氧体复合层，其中，所述铁氧体复合层包括发泡树脂，从而提高作为电磁屏蔽部件中的噪声防止用过滤芯片元件的重要特性的磁导率和Q值 。

    COIL COMPONENT
    7.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210210272A1

    公开(公告)日：2021-07-08

    申请号：US17085209

    申请日：2020-10-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyeon Yu SONG ,  Hyung Ho KIM ,  Sung Jin PARK ,  Sang Ho SHIN

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F41/04

    Abstract: A coil component includes a wound coil having a winding portion, having at least one turn, and a lead-out portion extending from an end portion of the winding portion to provide a separation space together with the winding portion and a body including an insulating resin and magnetic powder particles and embedding the wound coil therein. The body has a low-density portion disposed in the separation space and having magnetic powder particle density lower than average magnetic powder particle density of an entirety of the body.

    MULTILAYER BEAD AND BOARD HAVING THE SAME
    8.
    发明申请
    MULTILAYER BEAD AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190013121A1

    公开(公告)日：2019-01-10

    申请号：US15824947

    申请日：2017-11-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Jin HA ,  Jeong Hwan IM ,  So Young JUN ,  Sung Jin PARK

    IPC: H01C13/02 ,  H01F17/00 ,  H01C7/02 ,  H05K1/18 ,  H01F27/29

    Abstract: A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided.

    CHIP-TYPE COIL COMPONENT AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    CHIP-TYPE COIL COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    芯片型线圈组件及其制造方法

    公开(公告)号：US20160042858A1

    公开(公告)日：2016-02-11

    申请号：US14677803

    申请日：2015-04-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Sun PARK ,  Jae Yeol CHOI ,  Sung Jin PARK

    IPC: H01F27/28 ,  H01F41/00 ,  H01F27/29

    CPC classification number: H01F17/0013 ,  H01F27/292 ,  H01F41/041

    Abstract: A chip-type coil component may include: a ceramic body of which a lower surface is provided as a mounting surface and in which a plurality of ceramic layers with a plurality of recesses provided therein are stacked; and an internal coil structure disposed within the ceramic body and including internal coil patterns disposed on the plurality of ceramic layers, wherein the plurality of recesses are exposed to the lower surface of the ceramic body, and the plurality of recesses are filled with a plurality of conductive materials.

    Abstract translation: 芯片型线圈部件可以包括：陶瓷体，其下表面设置为安装表面，并且其中堆叠设置有多个凹部的多个陶瓷层; 以及内部线圈结构，其设置在所述陶瓷体内并且包括设置在所述多个陶瓷层上的内部线圈图案，其中所述多个凹部暴露于所述陶瓷体的下表面，并且所述多个凹部填充有多个 导电材料。

Patent Agency Ranking