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    COIL COMPONENT
    1.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20240062947A1

    公开(公告)日：2024-02-22

    申请号：US18386205

    申请日：2023-11-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Sik SHIN ,  Jae Wook LEE ,  Sung Young JO

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/12 ,  H01F41/04 ,  H01F27/32

    CPC classification number: H01F27/29 ,  H01F27/2804 ,  H01F41/12 ,  H01F41/041 ,  H01F27/32 ,  H01F2027/2809

    Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.

    COIL COMPONENT
    3.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210202157A1

    公开(公告)日：2021-07-01

    申请号：US16898877

    申请日：2020-06-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Sik SHIN ,  Jae Wook LEE ,  Sung Young JO

    IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04

    Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20200286674A1

    公开(公告)日：2020-09-10

    申请号：US16567520

    申请日：2019-09-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Ho HAN ,  Sung Sik SHIN ,  Jae Wook LEE

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20160233029A1

    公开(公告)日：2016-08-11

    申请号：US14942692

    申请日：2015-11-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Kwon OH ,  Jae Wook LEE ,  Min Sung CHOI ,  Jae Yeol CHOI

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

    Abstract: A multilayer ceramic electronic component includes a ceramic body having a stacked plurality of dielectric layers and first and second end portions and a plurality of lateral surfaces. A plurality of internal electrodes stacked in the ceramic body face each other with respective dielectric layers interposed therebetween and exposed to first and second lateral surfaces of the ceramic body opposing each other through respective lead portions thereof. At least two first external electrodes and at least two second external electrodes are provided on the first and second lateral surfaces to be connected to the respective lead portions, respectively. An insulation layer is provided on the first and second lateral surfaces of the ceramic body except for the first and second external electrodes.

    Abstract translation: 多层陶瓷电子部件包括陶瓷体，该陶瓷体具有堆叠的多个电介质层以及第一和第二端部以及多个侧面。 堆叠在陶瓷体中的多个内部电极彼此相对地分别插入各自的电介质层，并且暴露于陶瓷体的通过其引线部相互相对的第一和第二侧面。 至少两个第一外部电极和至少两个第二外部电极分别设置在第一和第二侧表面上以分别连接到相应的引线部分。 绝缘层设置在除了第一和第二外部电极之外的陶瓷体的第一和第二侧表面上。

    CHIP-TYPE COIL COMPONENT
    9.
    发明申请
    CHIP-TYPE COIL COMPONENT 有权
    芯片型线圈组件

    公开(公告)号：US20130293339A1

    公开(公告)日：2013-11-07

    申请号：US13937050

    申请日：2013-07-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG ,  Jae Wook LEE

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/292

    Abstract: The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.

    Abstract translation: 芯片型线圈部件包括：主体; 导电图案彼此连接以具有线圈结构; 以及形成在底表面上的两个表面和长度方向上的两个表面的外部电极; 其中，所述外部电极在所述主体的厚度方向上的高度大于所述导电图案中从所述底面到最远的导电图案的高度，并且小于从所述主体的底面到所述顶面的高度 其中。 根据本发明的实施例，即使在芯片型线圈部件组件与金属罐接触的情况下，也不会发生短路等干扰，结果是具有良好可靠性的芯片型线圈部件 可以获得。

    COIL COMPONENT
    10.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20230298806A1

    公开(公告)日：2023-09-21

    申请号：US18142808

    申请日：2023-05-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Sik SHIN ,  Jae Wook LEE ,  Sung Young JO

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/12 ,  H01F41/04 ,  H01F27/32

    CPC classification number: H01F27/29 ,  H01F27/2804 ,  H01F41/12 ,  H01F41/041 ,  H01F27/32 ,  H01F2027/2809

    Abstract: A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.

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