公开(公告)号：US20190131242A1

公开(公告)日：2019-05-02

申请号：US15981651

申请日：2018-05-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Ho LEE ,  Myung Sam KANG ,  Young Gwan KO ,  Shang Hoon SEO ,  Jin Su KIM

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; a first encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; an electronic component disposed on the other surface of the frame opposing one surface of the frame in which the semiconductor chip is disposed; a second encapsulant covering at least portions of the electronic component; and a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer, wherein the connection pads and the electronic component are electrically connected to each other through the wiring layers and the redistribution layer.