公开(公告)号：US20150144991A1

公开(公告)日：2015-05-28

申请号：US14275565

申请日：2014-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Job Ha

IPC: H01L23/495 ,  H01L23/373

CPC classification number: H01L23/49503 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein are a power module package and a method of manufacturing the same. The power module package includes first and second semiconductor devices mounted on sides of first and second lead frames, ends of which are separated from each other, respectively, a support pin corresponding to a mounting position of the first semiconductor device and formed adjacent to a lower portion of the first lead frame, and a molding portion formed to cover portions of the first and second lead frames and the first and second semiconductor devices.

Abstract translation: 这里公开了功率模块封装及其制造方法。 功率模块封装包括安装在第一和第二引线框架的侧面上的第一和第二半导体器件，其端部分别彼此分开，对应于第一半导体器件的安装位置并形成在下部 第一引线框架的一部分和形成为覆盖第一引线框架和第二引线框架以及第一和第二半导体器件的部分的模制部分。