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    Coil component
    11.
    发明授权
    Coil component 有权

    公开(公告)号：US11127517B2

    公开(公告)日：2021-09-21

    申请号：US16059626

    申请日：2018-08-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soon Kwang Kwon ,  Joong Won Park ,  Young Seuck Yoo

    IPC: H01F3/14 ,  H01F27/30 ,  H01B3/40 ,  H01F27/26 ,  H01F27/255 ,  H01F1/153 ,  H01F1/147

    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.

    COIL ELECTRONIC COMPONENT
    13.
    发明申请
    COIL ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210027926A1

    公开(公告)日：2021-01-28

    申请号：US16749376

    申请日：2020-01-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Jin Jeon ,  Soon Kwang Kwon ,  Seon Woo Oh

    IPC: H01F5/04 ,  H01F17/04 ,  H01F27/255 ,  H01F41/04

    Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

    COIL COMPONENT
    14.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20250029777A1

    公开(公告)日：2025-01-23

    申请号：US18650754

    申请日：2024-04-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Dong Hwan Lee ,  Dong Jin Lee ,  Soon Kwang Kwon ,  Boum Seock Kim

    IPC: H01F27/29 ,  H01F27/32

    Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface to the second surface; a coil disposed in the body and including a lead-out portion led out to the first surface or the second surface; and an external electrode disposed on the body and connected to the lead-out portion and including a first metal layer and a second metal layer. The first metal layer includes a first side surface facing the body and a second side surface opposing the first side surface, and the second metal layer is disposed on each of the first side surface and the second side surface of the first metal layer.

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