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公开(公告)号：US11763970B2
公开(公告)日：2023-09-19
申请号：US16749376
申请日：2020-01-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Soon Kwang Kwon , Seon Woo Oh
IPC: H01F5/04 , H01F17/04 , H01F27/255 , H01F41/04
CPC classification number: H01F5/04 , H01F17/04 , H01F27/255 , H01F41/04 , H01F2017/048
Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.
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公开(公告)号：US20130153266A1
公开(公告)日：2013-06-20
申请号：US13719036
申请日：2012-12-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Gul Hyun , Jin Gu Kim , Young Do Kweon , Hyung Jin Jeon
CPC classification number: H05K1/0296 , H05K1/0216 , H05K3/02 , H05K3/4673 , H05K2201/0391 , H05K2201/09781
Abstract: Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. D ≤ T 2 T 1 × 200 1.2 [ Equation 1 ] (Where D represents a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns, T1 represents a thickness of the circuit pattern or the dummy pattern, and T2 represents a maximum thickness of the insulating layer formed on the circuit pattern or the dummy pattern.)
Abstract translation: 本文公开了一种印刷电路板，包括：基底; 形成在所述基底基板上的至少一个电路图案; 形成在所述基底基板上的至少一个虚设图案; 以及形成在电路图案和虚设图案上的绝缘层，其中电路图案和虚设图案中的彼此之间的相邻图案之间的距离满足以下等式1. D <= T 2 2 T1×200 1.2 [等式1]（其中D表示电路图案和虚设图案中彼此相邻图案之间的距离，T1表示电路图案或虚设图案的厚度，T2表示绝缘体的最大厚度 层形成在电路图案或虚拟图案上。）
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公开(公告)号：US20210027926A1
公开(公告)日：2021-01-28
申请号：US16749376
申请日：2020-01-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Soon Kwang Kwon , Seon Woo Oh
IPC: H01F5/04 , H01F17/04 , H01F27/255 , H01F41/04
Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.
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公开(公告)号：US09928953B2
公开(公告)日：2018-03-27
申请号：US14973110
申请日：2015-12-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Jung Wook Seo , Eun Hye Na
IPC: H01F5/00 , H01F27/28 , H01F27/255 , H01F27/29 , H01F41/04
CPC classification number: H01F27/2804 , H01F27/255 , H01F27/292 , H01F41/046 , H01F2027/2809
Abstract: A coil component may include a core element, a coil conductor embedded in a surface of the core element, and a cover element bonded to the surface of the core element in which the coil conductor is embedded. Since the core element and the cover element are integrally formed, common failures, such as delamination or cracks, may be suppressed, and thereby product reliability may be improved.
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公开(公告)号：US09609183B2
公开(公告)日：2017-03-28
申请号：US14463438
申请日：2014-08-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kang Ryong Choi , Hyung Jin Jeon , Jeong Gu Yeo , Kang Heon Hur , Sung Yong An , Jung Wook Seo
IPC: H04N5/225
CPC classification number: H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257
Abstract: There is provided a camera module including: a lens housing in which a lens is disposed; a glass cover formed of a transparent material and covering the lens housing; and a coil conductive part formed between an outer surface of the lens and an inner surface of the glass cover.
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Patent Agency Ranking
6.发明授权公开(公告)号：US09966179B2
公开(公告)日：2018-05-08
申请号：US15099921
申请日：2016-04-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chin Mo Kim , Jung Wook Seo , Eun Hye Na , Hak Kwan Kim , Hyung Jin Jeon , Sung Yong An
IPC: H01F27/255 , H01F17/00 , H01F1/34
CPC classification number: H01F27/255 , H01F1/348 , H01F17/0013 , H01F2017/0093
Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
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公开(公告)号：US09196506B2
公开(公告)日：2015-11-24
申请号：US13632614
申请日：2012-10-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Jong In Ryu , Seung Wan Shin , Seon Hee Moon , Young Do Kweon , Seung Wook Park
IPC: H01L21/48 , H01L23/498 , H05K3/46 , H05K3/24 , H05K3/42
CPC classification number: H01L21/486 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L2225/06572 , H01L2924/0002 , H05K3/244 , H05K3/427 , H05K3/4602 , H05K3/4605 , H05K3/4644 , H05K2201/0979 , H05K2201/10378 , H01L2924/00
Abstract: A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.
Abstract translation: 一种用于制造插入件的方法包括在包括树脂或陶瓷的绝缘板中形成通孔; 同时在绝缘板的顶表面上形成用于第一上再分配层的抗蚀剂，以及在绝缘板的底表面上的下再分布层的电阻器; 电镀铜以填充通孔并同时沿着设计的电路图形形成第一上再分配层和下再分布层; 以及形成第一上保护层和下保护层以暴露所述第一上再分布层的一部分和所述下再分布层的一部分。
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公开(公告)号：US09173291B2
公开(公告)日：2015-10-27
申请号：US14060345
申请日：2013-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Han , Young Do Kweon , Jin Gu Kim , Hyung Jin Jeon , Yoon Su Kim
CPC classification number: H05K1/116 , H05K1/113 , H05K3/0017 , H05K3/002 , H05K3/421 , H05K2201/0195 , H05K2201/09563 , H05K2201/09854 , H05K2203/0733
Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.
Abstract translation: 本发明涉及一种电路板。 根据本发明实施例的电路板包括：基底; 覆盖基底的层间绝缘层; 通孔结构至少穿过基底衬底的层间绝缘层和层间绝缘层在垂直方向上; 以及在水平方向上设置在层间绝缘层上以围绕通孔结构并由绝缘材料制成的蚀刻停止图案。
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公开(公告)号：US11538620B2
公开(公告)日：2022-12-27
申请号：US16834250
申请日：2020-03-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jin Jeon , Soon Kwang Kwon
Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.
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公开(公告)号：US20150055009A1
公开(公告)日：2015-02-26
申请号：US14463438
申请日：2014-08-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kang Ryong Choi , Hyung Jin Jeon , Jeong Gu Yeo , Kang Heon Hur , Sung Yong An , Jung Wook Seo
IPC: H04N5/225
CPC classification number: H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257
Abstract: There is provided a camera module including: a lens housing in which a lens is disposed; a glass cover formed of a transparent material and covering the lens housing; and a coil conductive part formed between an outer surface of the lens and an inner surface of the glass cover.
Abstract translation: 提供了一种相机模块，包括：透镜壳体，其中设置透镜; 由透明材料形成并覆盖透镜壳体的玻璃盖; 以及形成在所述透镜的外表面和所述玻璃罩的内表面之间的线圈导电部。
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