公开(公告)号：US20230125546A1

公开(公告)日：2023-04-27

申请号：US17452489

申请日：2021-10-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyungOe Kim ,  YoungCheol Kim ,  HeeSoo Lee

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L31/12 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.

公开(公告)号：US20210225778A1

公开(公告)日：2021-07-22

申请号：US17032005

申请日：2020-09-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YoungCheol Kim ,  ChoonHeung Lee ,  WonGyou Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device has a substrate and a plurality of bond wires is disposed in a pattern across on the substrate. The pattern of bond wires can be a plurality of rows of bond wires. A plurality of electrical components is disposed over the substrate as an SIP module. An encapsulant is deposited over the substrate, electrical components, and bond wire. An opening is formed in the encapsulant extending to the bond wire. The opening can be a trench extending across the bond wires disposed on the substrate, or a plurality of openings individually exposing each of a plurality of bond wires. A conductive material is disposed in the opening. A shielding layer is formed over the encapsulant and in contact with the conductive material. The shielding layer, conductive material, and bond wires reduce the effects of EMI, RFI, and other inter-device interference.