METHOD FOR MANUFACTURING A FLUID EJECTION DEVICE AND FLUID EJECTION DEVICE
    12.
    发明申请
    METHOD FOR MANUFACTURING A FLUID EJECTION DEVICE AND FLUID EJECTION DEVICE 有权
    制造流体喷射装置和流体喷射装置的方法

    公开(公告)号:US20140313264A1

    公开(公告)日:2014-10-23

    申请号:US14253276

    申请日:2014-04-15

    Abstract: A method for manufacturing a fluid ejection device, comprising the steps of: providing a first semiconductor body having a membrane layer and a piezoelectric actuator which extends over the membrane layer; forming a cavity underneath the membrane layer to form a suspended membrane; providing a second semiconductor body; making, in the second semiconductor body, an inlet through hole configured to form a supply channel of the fluid ejection device; providing a third semiconductor body; forming a recess in the third semiconductor body; forming an outlet channel through the third semiconductor body to form an ejection nozzle of the fluid ejection device; coupling the first semiconductor body with the third semiconductor body and the first semiconductor body with the second semiconductor body in such a way that the piezoelectric actuator is completely housed in the first recess, and the second recess forms an internal chamber of the fluid ejection device.

    Abstract translation: 一种制造流体喷射装置的方法,包括以下步骤:提供具有膜层的第一半导体主体和在膜层上延伸的压电致动器; 在膜层下方形成空腔以形成悬浮膜; 提供第二半导体本体; 在所述第二半导体本体中形成入口通孔,所述入口通孔被构造成形成所述流体喷射装置的供应通道; 提供第三半导体体; 在所述第三半导体本体中形成凹部; 形成通过所述第三半导体主体的出口通道以形成所述流体喷射装置的喷嘴; 将第一半导体本体与第三半导体本体和第一半导体本体与第二半导体本体耦合,使得压电致动器完全容纳在第一凹部中,并且第二凹部形成流体喷射装置的内部腔室。

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