公开(公告)号：US20170141069A1

公开(公告)日：2017-05-18

申请号：US15137144

申请日：2016-04-25

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Nicolas Froidevaux ,  Yann Bacher

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/50 ,  H01L23/5286 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2924/14 ,  H01L2924/00014

Abstract: An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.