公开(公告)号：US20170141069A1

公开(公告)日：2017-05-18

申请号：US15137144

申请日：2016-04-25

申请人： STMicroelectronics (Rousset) SAS

发明人： Nicolas Froidevaux ,  Yann Bacher

IPC分类号： H01L23/00 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/50 ,  H01L23/5286 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2924/14 ,  H01L2924/00014

摘要： An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.

公开(公告)号：US10217717B2

公开(公告)日：2019-02-26

申请号：US15137144

申请日：2016-04-25

申请人： STMicroelectronics (Rousset) SAS

发明人： Nicolas Froidevaux ,  Yann Bacher

IPC分类号： H01L23/00 ,  H01L23/50 ,  H01L23/528 ,  H01L23/31

摘要： An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.

公开(公告)号：US09638728B2

公开(公告)日：2017-05-02

申请号：US14947858

申请日：2015-11-20

申请人： STMicroelectronics (Rousset) SAS

发明人： Yann Bacher ,  Nicolas Froidevaux

IPC分类号： G01R19/165 ,  H02M3/04 ,  G01R19/25

CPC分类号： G01R19/16585 ,  G01R19/2503 ,  H02M3/04

摘要： A circuit has a supply line, a reference line and circuitry coupled between the supply line and the reference line. The circuitry outputs a regulated voltage and a measurement voltage. An analog-to-digital converter (ADC) generates a digital signal indicative of variations of potential differences between the supply line and the reference line based on the regulated voltage and the measurement voltage. The generated digital signal may be used to control the circuit.